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FDMS8x

Dual Cool™ MOSFET
The Dual Cool package is a top-side cooling PQFN device that incorporates new packaging technology which enables additional power dissipation through the top of the package resulting in more than 60 percent higher power dissipation capability than standard PQFN packaging when a heat sink is mounted.

Features:
• More than 60% better power dissipation
• Highest power density for DC-DC applications
• Lower operating temperature increases reliability
• Available in Dual Cool 88 (8 x 8 mm), Dual Cool 56 (5 x 6 mm), and Dual Cool 33 (3.3 x 3.3 mm) packaging options


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FDMC8x

USB Type-C™ Portfolio
The new USB Type-C standard enables higher performance and promises convenience for users as well as simplicity for designers and manufacturers. Fairchild's complete portfolio
of discrete, flexible USB Type-C solutions—from controllers to power switches and
SuperSpeed switches—is optimized for cost, footprint, and low-power consumption.
Solutions cover DRP/DFP/UFP implementations and accessory detection while providing software flexibility for multi-platform support. I2C communication with existing microprocessors also enables easy updates for future standard software changes.

Features:
• Ultra-low-power consumption in standby mode
• Small solutions in WLCSP and MLP, as small as 1.2 x 1.2 x 0.4 mm
• Flexible to accommodate standard changes
• DFP, UFP, DRP role support
• Active cable detection and power support
• Thin USB PD interface for adaptive charging and vendor-defined messages
• Audio and Debug Accessory Detection


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