Indianapolis Technology and Innovation Event 

PROVIDING TECHNICAL SOLUTIONS AND DEMONSTRATING TECHNOLOGIES RELEVANT TO YOUR NEEDS 

 



















2ND Annual Future Electronics Indianapolis Technology and Innovation Event
PROVIDING TECHNICAL SOLUTIONS AND DEMONSTRATING TECHNOLOGIES RELEVANT TO YOUR NEEDS.

EVENT OVERVIEW
Meet with many of the Industries top electronic component suppliers with more than 38 supplier booths supplying the most up to date product information across a wide range of technologies.

Visit our Engineering and Technology room where we will be displaying technologies from ANALOG, POWER, DISPLAYS, SENSORS, LEDS, INTERCONNECT, MICROCONTROLLERS, WIRELESS AND BLUETOOTH, CELLULAR, ANTENNAS, FPGAS and much more. Come in and talk technical or look at a demo.

20 technical workshops/seminars. Participate or join in on a workshop or seminar to deep dive into a specific technology, product or application. Look at the detailed workshop/seminar list provided and schedule. Register to up to 4 different workshop/seminars.

Receive a great gift upon registration. Win great prizes given out throughout the day from gift cards to TVs to Bluetooth Speakers, Grills, LED lights, Espresso machines and much much more. Visit every supplier booth to qualify for the grand prize drawing of $500.

REGISTER NOW


WHERE: IWU Indianapolis North Education Center – 3777 Priority Way S Drive, Indianapolis, IN, 46240
WHEN: Thursday, August 30th, 2018
RSVP: Register Online by August 24th, 2018

PARTICIPANTS WILL RECEIVE COFFEE, LUNCH, DRINKS AND SNACKS. a.m.AZING PRIZE DRAWINGS AND GIVEAWAYS.

AGENDA
Registration starts at 8:00 a.m.
Event is open from 8:30 a.m. - 4:30 p.m.
Seminars/Workshops run from 8:30 a.m. - 4:00 p.m.
Future Engineering/Technology room open from 9:00 a.m. - 4:30 p.m.
Supplier Product Booths open from 9:00 a.m. - 4:30 p.m.
Lunch: 11:30 a.m. - 1:00 p.m.
Prize drawings throughout the day and $500 Grand Prize Draw at 4:30 p.m.

  Event Schedule:  
Time DOWNSTAIRS UPSTAIRS
ROOM 111 ROOM 113 ROOM 200 ROOM 202 ROOM 204
Connectivity Solutions Microprocessor Solutions Sensing Solutions Interconnect Solutions
8:30 - 9:45a.m. PANASONIC MICROCHIP Supply Chain by Andy Bowers MURATA WECO
10:15 - 11:30a.m. CYPRESS NXP FET Switching Solutions by INFINEON ST MICRO TE CONNECTIVITY
11:30 - 1:00p.m. LUNCH
Connectivity Solutions Interface, Wireless Connection and Cloud Based Solutions Displays and Antennas Sensing Solutions Circuit Protection and Filtering
1:00 - 2:15p.m. ON SEMI RENESAS EPSON IDT LITTELFUSE
2:45 - 4:00p.m. SEMTECH LATTICE AVX MELEXIS QUALCOMM/RF 360


REGISTER NOW



Workshop Summary

ANDY BOWERS NEGOTIATING LONG LEADTIMES: Futures Supply Chain Solutions When leadtimes are extended, Supply Chain Solutions come under increasing pressure. This session will review some of the options available to increasing Security of Supply in the market.
CYPRESS Cypress Semiconductor and the Internet of Things. Come learn about Cypress’s product offerings in the IoT space, supporting BlueTooth Classic, Bluetooth Low Energy (BLE), and WiFi. You will learn about Cypress’s IC and Certified Module offerings to help speed your design to production. See how the WICED and PSoC Creator design environments simplify your firmware develop.m.ent and allow you to start new designs from dozens of proven exa.m.ple projects. Special focus will be on Cypress’s PSOC 6 fa.m.ily. PSoC 6 is Cypress’ newest PSoC MCU, purpose-built for the IoT, delivering the industry’s lowest-power, most-flexible, and most-secure MCU for the IoT.  And like every PSoC, PSoC 6 features Progra.m.mable Digital, Progra.m.mable Analog, and Progra.m.mable I/O beyond anything available in any other MCU product.
INFINEON Title: Choosing the Right FET for Your Application. Different applications require FETs with different characteristics and capabilities. This session will show how to avoid design issues from Electrical Over Stress ( EOS ) due to choosing the wrong FET. We will discuss the key para.m.eters to look for in a FET based on various applications. Areas covered will address heat concerns, power requirements, switching requirements, circuit protection, packaging and avalanche.
INTEGRATED DEVICE TECHNOLOGY Industrial Sensor Design and Implementation with IDT’s Sensors & Signal Conditioners: This class will address the key challenges faced in the Industrial IoT Ecosystem including: Optimizing precision signal path circuits for power consumption as well as implementation of gas, flow, humidity, VOC and position sensing.
LATTICE Lattice Semiconductor’s low cost low power progra.m.mable devices have long been used to bridge interfaces.  In this technical session we will show how to use the Embedded Vision Develop.m.ent kit to bridge MIPI CSI2 ca.m.era interface to parallel RGB, HDMI, Ethernet and USB3.  Finally we will explore the Lattice Semiconductor wireless SNAP technology.  SNAP provides a full duplex 6 Gbps wireless USB3 connector replacement.  We will demonstrate how SNAP can be easily connected between a USB3 device and a host Laptop.
MELEXIS TECHNOLOGIES NV Speed, Position and Angular sensing using 3D Hall Effect sensors. Contactless temperature sensing using Far Infrared sensors Distance and gesture sensing using Time of Flight
MICROCHIP Ease Develop.m.ent of Secure Linux-based IoT Applications:  Microchip’s Cortex A5 based MPU can help reduce the time to market of your next Linux-based secure IoT application by greatly simplifying your hardware design and software develop.m.ent while at the sa.m.e time reducing the overall PCB complexity and cost. 
NXP i.MX RT CROSSOVER PROCESSOR - HOW TO ACHIEVE PERFORMANCE AND USABILITY FOR YOUR DESIGN. Today’s applications require higher performance and real-time response. Data processing, wireless connectivity and display support are essential but these next-gen features increase costs and cause redesigns that extend your time-to-market. A convergence in the embedded processing world is emerging. More capable, less expensive applications processors are beginning to merge with high performance, low power Arm® Cortex®-M7 based MCUs. This exciting crossover opens new possibilities for embedded engineers who require: Higher performance, Short interrupt latency, Lower BOM, Power efficiency, Security. This seminar will focus on the i.MX RT crossover processor – the first solution that truly bridges the gap between MCUs and applications processor with low power, scalability, high performance computation and security – all at a cost-effective price.
ON SEMICONDUCTOR Industrial IoT: Connectivity, Sensing, and Power Delivery. Ultra-Low Power Wireless Communication and Sensing. Your BLE 5 System in Package Integrated with IoT Sensors. ON Semiconductor is excited to promote the new BLE 5, multi-protocol, certified radio System in Package (SiP) which brings ultra-low-power wireless technology to industrial IoT. For wired connectivity needs, ON Semiconductor now offers a complete solution for USB Type C with Power Delivery along with highly efficient Power Over Ethernet (PoE) using configurable DC-DC converters and controllers. In order to assist in your IoT application, we will also be covering a focused sensor portfolio of image sensors and sensors incorporated onto ON Semiconductor’s IoT Develop.m.ent Kit. Demos will be displayed at exposition.
PANASONIC IoT and Wireless, what is missing? IoT is the growth locomotive of many products and segments, from Smart Houses and Smart Cities and Building. Wireless is the key connectivity means, but what is missing – How MESH and IPv6 are the key steps for the resolution.

Panasonic Smart Solutions with Sensors: Sensor technology as it relates to IoT & other smart solution Focus on pressure, passive infrared and thermopile array sensory
RENESAS Renesas presents our AE-CLOUD1 that enables rapid evaluation, prototyping, and develop.m.ent of cloud connected applications. It features the S5D9 MCU Group, the superset of the S5 MCU series. The AE-CLOUD1 kit comes pre-progra.m.med with the firmware needed to connect to the Renesas IoT Sandbox that includes a.m.azon Web Services, Microsoft Azure, or Google Cloud.
ST MICROELECTRONICS ST and Future have unique platforms for easy demonstration, evaluation and prototyping of the IoT funda.m.entals of sensing, processing and communicating: STidget, SensorTile and BlueCoin. This class will explore the options and technologies of these platforms including low-power and high-performance 9-axis inertial and environmental sensors, ranging sensors, a cluster of 4 digital MEMS microphones with Bluetooth Smart and a high-performance STM32 which enables real-time implementation of very advanced sensor fusion and IoT applications.

The Smart STidget Spinner is a fun and idea provoking demo of implementing technology into previously non-technical devices. SensorTile is a highly integrated reference design that can be plugged into form-factor prototypes, adding sensing and connectivity capabilities to new designs through a smart hub solution. It can also easily support develop.m.ent of monitoring and tracking applications like standalone sensor nodes connected to iOS™ or Android™ smartphone applications. Inspired by the listening and balancing capabilities associated with the human ear, BlueCoin enables designers to explore advanced sensor fusion and signal processing functionalities well suitable for robotics and automation applications.
TE CONNECTIVITY Next generation sealed Power Connector for use in applications that that need protection from liquids, humidity, and liquid splashing.  More specifically, the connectors are protected from dust and are capable of withstanding water immersion between 15cm and 1 meter for 30 seconds.  This versatile connector solution can be used in a wide variety of industries (Appliance, Industrial, Lighting, Automotive, etc) and is a cost effective solution.  The presentation will highlight the competitive advantages of this product and also application specific usages.  We will also plan to have sa.m.ples to distribute to customers.
AVX AVX Wireless/RF Components – Antennas and the discrete RF Signal Chain Passives/Filters. In addition capacitors, protection devices, and connectors, AVX is a major supplier in the RF signal chain from the Antenna up to the IC.  Utilizing thin film and other technologies, AVX has developed capacitors, inductors, protection devices, resistors, diplexers, and filters that satisfy today’s needs for signal integrity with multiple wireless formats.  Recently, AVX acquired Ethertronics who is a premiere antenna manufacturer of both active and passive solutions for Cellular, WiFi, Bluetooth, ISM, and GPS using technology like sta.m.ped metal, chip level, FPC, and a proprietary IMD (Isolated Magnetic Dipole) for dense packaging.  AVX/Ethertronics has dedicated design and testing resources to make your wireless design a success.  Please join AVX to learn how to design a robust signal chain in one of last analog frontiers, antenna to IC.
WECO Electrical Connector Solutions for Thermo Expansion, Shock and Vibration Environments. WECO will discuss and feature SmartConn SMD/SMT solutions which is a connector technology. SmartConn Technology applications provide pre and post PCBA environment solutions that compensation for thermo expansion as well as insure coplanar adhesion of the component and solder joint on the PCBA. This technology provides unique features and benefits such as the floating pins and anchors, that adjust under stress for improved solder joint adhesion to the PCB. These technologies also compensate for thermal expansion of the connector housing during the reflow process. An overview of the components offered in the SMarTConn product offering will be presented. The key performance characteristics for installation and their applications will be reviewed. The product offering is available in various pin sizes, pitch, packaging, number of poles and plug in connectors to meet different wire angle entry requirements.

Our discussion will further focus on electrical connector potting applications and connector solutions. In electronics, potting is a process of incapsulating an electronic assembly with a solid or gelatinous compound for ‘Resistance to Shock and Vibration” and for the “Exclusion of Moisture and /or Corrosive Agents”.

We will also cover a variety of solutions focused on materials and applications that ensure and protect high quality electrical performance.
Qualcomm RF360 QUALCOMM (RF360- A QUALCOMM & TDK JOINT VENTURE) As IoT systems become more advanced and prolifereated, the need to filter out unwanted emissions, coexistnet radio frequencies and harmonics will be more and more important. RF360 SAW Filters are the most effective solution to eliminate unwanted signals from frequencies ouside of your intended frequency band. RF360offers SAW filters covering the entire spectrum of the ISM and Celullar bands enabling the application in the IoT spectrum from 300 MHz to 2.4 GHz. RF360 SAW filters are esigned for spectrum challenging applications and are optimized for harsh environments like high temperature and humidity. With their small packaging footprints as small as 1.1x0.9mm, these high performing SAW filters are cost competitive and can easily be incorporated into the smallest of "things" Further, RF360 SAW filters can be customized for specific applications and AEC-Q200 compliance.
LITTELFUSE ESD Funda.m.entals and Protection Solutions: ESD threat can result in soft or hard failure of sensitive electronic equip.m.ent.  Industry trends in reduced on chip protection and harsher end user environments are leading to the need for enhanced protection solutions.  Choosing the right protection and understand critical design factors are key in ensuring long term reliable operation of your design.  This presentation covers the differences between certain ESD test standards, protection technology comparisons, design considerations, and application exa.m.ples.
MURATA Murata Sensors - Murata’s Newest and Best-in-Class Sensors

Murata's sensor portfolio offers best in-class accuracy and highest resolution in the industry, as well as, 25 years of experience in safety critical markets. Murata’s portfolio includes sensors for the automotive, healthcare, industrial and energy markets. Murata’s MEMS Accelerometers, Gyro and Combination Sensors offer robustness for applications with extreme environmental factors such as mechanical vibration. Additionally, Murata sensors provide high stability over temperature. Murata’s Ultrasonic sensors support autonomous driving and talking assist develop.m.ent activity. Murata Thermistors offer high thermal reliability, high soldering heat resistance and no hysteresis characteristics.
EPSON Epson Display Solutions for Consumer and Industrial Systems. The recent times has seen a surge in Human Machine Interface (HMI) than ever before in all electronics systems incuding those in consumer, industrial, and automotive. Users have been demanding more system and info to be displayed in easier to use, sleek display systems. As such, hardware engineers and systems integrators are demanding more innovative, and feature-rich display solutions that are cost-effective as well as easy-to-use for shorter-time to develop.m.ent. In this presentation, we will discuss some of the products and features that make Epson display solutions the preferred choice for our customers in various segments including, consumer, industrial, medical and automotive. The braod portfolio of Epson available today provides a one-stop solution for our customers providing a variety of alternatives. These range from simple, but ubiquitous segment LED displays to LCD controllers (supporting QVGA all the way to XGA display resolutions) to high-end memory display controllers to a variety of automotive display solutions to support the growing demand for digital displays. In this presentation, we will talk about key display features that our customers come to expect from IC vendors and Epsons unique offerings that differentiate us in the industry. Last, but not the least, we will provide a quick overview of the latest products and tools, as well as the roadmaps to offer value-add HMI and display solutions to Epson customers.
SEMTECH Connecting virtually all things─sensors, gateways, machines, devices, animals,  people—LoRa Technology makes it possible to connect to the Cloud, enabling sound decisions and making people’s lives better. Come see why Lora has become the standard for LPWAN, and is being deployed in 50+ countries WW…and why Comcast/MachineQ selected Lora for their IOT platforms in the US. Learn how wireless RF technology is used in LPWANs for M2M and IoT applications thanks to low power consumption and secure data transmission. LoRa long range wireless products are the ultimate solution for eliminating repeaters, reducing cost, extending battery life and improving network capacity.

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