The Tyco Electronics DIPLOMATE Dual Leaf (DL) DIP socket family provides high quality at low cost with superior handling characteristics.
Sockets are available in 6- through 64- position sizes with dual wiping contacts in tin and gold plating over beryllium copper or economical phosphor bronze.
The large target area of the contacts and tapered side ramps in the housing insure easy entry of a DIP package. Internal anti-overstress walls on standard versions prevent contact damage. The housings are compatible with commercially available automatic insertion equipment for socket-to-board or DIP-to-socket applications. These stackable housings feature a "true closed bottom" design which prevents solder or flux wicking at class 1 conditions of EIA 486.
Standoffs provide board clearance for proper cleaning after soldering. Sockets are available with straight solder tails for clinching and are "true positioned" for automatic insertion into the pc board. Solder tails with retention feature, for self retention in the pc board during handling and flow soldering, are available for hand insertion.
Housings are constructed from self-extinguishing glass-filled polyester, 94 V-0 rated material.
The DIPLOMATE DL DIP Socket family meets the requirements of EIA RS-415, MIL-S-83734 and the most stringent specifications of main-frame computer manufacturers.