The Tyco Electronics family of Low Profile Plastic Leaded Chip Carrier (PLCC) Sockets for surface mounting is designed to accommodate Plastic "J" leaded, tin plated devices made to JEDEC Specifications MS-018 (square packages) and MS-016-AE (rectangular packages).

Sockets are available in the new improved low insertion force design that incorporates a unique contact method, allowing the PLCC device to be more easily inserted into the socket.

Available in 20, 28, 32, 44, 52, 68 and 84 positions, these sockets feature high normal force contacts made from phosphor bronze material with tin-lead over nickel plating. Sockets feature a one-piece polyphenylene sulfide (PPS) housing that will withstand vapor-phase I.R. or convection reflow soldering temperatures and prevent flux and solvent entrapment.

The low profile housing is only .185 [4.7] high, maximum allowing high density printed circuit board stacking. The open bottom design enables easy socket placement on the pc board footprint pattern and facilitates solder joint repair and inspection as well as permitting the heat source to penetrate to the solder pad and surface mount contact. The socket uses the same footprint pattern as the chip carrier.

Sockets are also available on embossed tape made to EIA Standard 481 which allows interchangeability of tape in commercially available pick-and-place equipment.