Future Electronics’ Newest Creation: Bullseye Evaluation Board

TechVentures with Lazina Future Electronics IoT Node Solution Development Board

In this TechVentures video, Future Electronics’ Technical Marketing Engineer Lazina Rahman unpacks the Bullseye Board, a new Future Electronics wireless IoT node solution made with solutions leading industry partners: Panasonic, TE Connectivity, Renesas, MPS and Infineon.

The Latest in Embedded Systems

The Latest in Embedded Systems

In this episode, Todd Speaks to Rick Dudley, Business Development Manager at Microchip about how engineers can make the choice to move from a microcontroller to a microprocessor for their applications.

Future Electronics at Embedded World

Future Electronics at Embedded World

In this episode, Todd speaks to Lazina Rahman, Future Electronics Technical Engineer and host of TechVentures, who is on location at the conference.

Wide Bandgap to Maximize Power

The Current S2E12 | Wide Bandgap to Maximize Power

In this episode, Todd speaks with Doug Bailey, Power Integrations Vice President of Marketing and Applications, about wide bandgap technologies and trying to demystify when they should be used in system designs.

The Evolution of 5G Design

The Evolution of 5G Design | The Current S2 E10

In this episode, Todd Baker speaks with Brian Donavan and Jeff Katz from Panasonic about the key technologies on the periphery of 5G designs.