The Infineon AIROC™ CYW43022 is an ultra-low power single-chip combo solution featuring dual-band Wi-Fi 5 (802.11ac) and Bluetooth® 5.4. Designed for battery-powered applications, the CYW43022 delivers best-in-class power efficiency while maintaining seamless connectivity, even when the host processor is in low-power sleep mode.
With 1×1 SISO, support for 256-QAM, and data rates up to 78 Mbps, this module ensures reliable wireless performance. Its integrated power amplifiers (PA) and low-noise amplifiers (LNA) for both 2.4 GHz and 5 GHz bands further enhance signal strength and efficiency.
The CYW43022 is available as a module from AzureWave through our partner network.
Key Features
Wi-Fi Performance
- Wi-Fi 5 (802.11ac) Dual-Band (2.4/5 GHz)
- 1×1 SISO with MCS8 (256-QAM) for 20MHz channels
- Up to 78 Mbps PHY data rate
- Integrated PA & LNA for both bands
Bluetooth® Capabilities
- Class 1 (100m) and Class 2 (10m) operation
- +20dBm Tx power from internal PA
- Supports BDR (1 Mbps), EDR (2/3 Mbps), Bluetooth® LE (1/2 Mbps)
- Compliant with Bluetooth® 5.4 specification
- Declaration ID: D062318 | QDID: 207748
Power & Interface Options
- Best-in-class power consumption in active and power-saving modes
- MCU network offload with embedded Bluetooth® stack
- SPI and SDIO v2.0/v3.0 for Wi-Fi
- Optional shared SDIO host interface for Wi-Fi and Bluetooth®
- UART/PCM host interface for Bluetooth®
- Support for RTOS and Linux/Android (A-Class) host designs
- 40 GPIOs
Coexistence Features
- 2-wire SECI for external BT/LTE
- 3-wire GCI
Compact Package
- 106-ball WLBGA (3.76 x 4.43mm; 0.35mm pitch)
- 251-pin WLCSP (3.76 x 4.43mm; 0.2mm pitch)
Operating Temperature
- -20°C to +70°C
