{"id":5873,"date":"2025-04-30T15:00:00","date_gmt":"2025-04-30T19:00:00","guid":{"rendered":"https:\/\/www.futureelectronics.com\/blog\/?p=5873"},"modified":"2026-02-12T14:35:55","modified_gmt":"2026-02-12T19:35:55","slug":"techventures-with-lazina-ep-28-at-embedded-world-2025","status":"publish","type":"post","link":"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/","title":{"rendered":"TechVentures with Lazina | Ep 28 &#8211; At Embedded World 2025"},"content":{"rendered":"\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-28f84493 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-vertically-aligned-center is-layout-flow wp-block-column-is-layout-flow\">\n<p>Join Lazina on a whirlwind tour of Embedded World 2025 in this episode of Techventures with Lazina! From AI-powered foosball tables to smart healthcare, industrial automation, and edge AI in action\u2014this year&#8217;s innovations were all about intelligence at the edge.<\/p>\n\n\n\n<p>We\u2019ll explore standout demos from STMicroelectronics, NXP, Renesas, Infineon, Bosch Sensortec and onsemi, covering everything from BLE asset tracking to vision AI, motor control, gesture sensing, and Matter-connected smart homes!<\/p>\n<\/div>\n\n\n\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:60%\">\n<div style=\"position: relative; padding-bottom: 56.25%; height: 0; overflow: hidden; max-width: 100%; height: auto;\">\n  <iframe src=\"https:\/\/www.youtube.com\/embed\/ws3fQE4QD4w\" title=\"YouTube video player\" style=\"position: absolute; top: 0; left: 0; width: 100%; height: 100%;\" frameborder=\"0\" allow=\"accelerometer; autoplay; clipboard-write; encrypted-media; gyroscope; picture-in-picture; web-share\" allowfullscreen=\"\">\n  <\/iframe>\n<\/div>\n\n\n\n<div class=\"wp-block-group is-layout-constrained wp-block-group-is-layout-constrained\">\n<p class=\"has-text-align-right\"><\/p>\n<\/div>\n<\/div>\n<\/div>\n\n\n\n<p class=\"has-text-align-left\"><strong>Related Products: <\/strong><\/p>\n\n\n\n<p class=\"has-text-align-left\">STMicroelectronics | Camera Modules- <a href=\"https:\/\/www.futureelectronics.com\/p\/semiconductors--analog--sensors--cameras-camera-modules\/fut-vd66gy-mipi-152ff-ch1-650-chippack-1187275\" target=\"_blank\" rel=\"noreferrer noopener\"><strong>FUT-VD66GY-MIPI-152FF-CH1-650<\/strong><\/a><strong>&nbsp;<\/strong>&nbsp;<\/p>\n\n\n\n<p class=\"has-text-align-left\">NXP | Wireless RF \/ Development Tool &#8211; <a href=\"https:\/\/www.futureelectronics.com\/p\/semiconductors--wireless-rf--rf-wireless\/frdm-rw612-nxp-7190973\" target=\"_blank\" rel=\"noreferrer noopener\"><strong>FRDM-RW612<\/strong><\/a> &nbsp;<\/p>\n\n\n\n<p class=\"has-text-align-left\">Infineon | Dev Tools \u2013 Sensors &#8211; &nbsp;&nbsp;<a href=\"https:\/\/www.futureelectronics.com\/p\/development-tools--dev-tools-sensors\/s2go3dtle493dw2b6a0tobo1-infineon-6122558\" target=\"_blank\" rel=\"noreferrer noopener\"><strong>S2GO3DTLE493DW2B6A0TOBO1<\/strong><\/a> &nbsp; &nbsp;<\/p>\n\n\n\n<p class=\"has-text-align-left\">Renesas | Wireless \/ RF Development tool &#8211; <a href=\"https:\/\/www.futureelectronics.com\/p\/semiconductors--wireless-rf--rf-wireless\/da14592-016fdevkt-p-renesas-1181301\" target=\"_blank\" rel=\"noreferrer noopener\"><strong>DA14592-016FDEVKT-P<\/strong><\/a> &nbsp; &nbsp;<\/p>\n\n\n\n<p class=\"has-text-align-left\">Bosch Sensortec | Dev Tools \/ Sensors &#8211; <a href=\"https:\/\/www.futureelectronics.com\/p\/development-tools--dev-tools-sensors\/shuttle-board-3-0-bmp581-bosch-sensortec-4163351\" target=\"_blank\" rel=\"noreferrer noopener\"><strong>SHUTTLE BOARD 3.0 BMP581<\/strong><\/a><strong> <\/strong>&nbsp;<\/p>\n\n\n\n<p class=\"has-text-align-left\">onsemi | Image Sensors &#8211;<strong> <\/strong><a href=\"https:\/\/www.futureelectronics.com\/p\/semiconductors--analog--sensors--image\/ar0145cssm00smka0-cp2-onsemi-2196259\" target=\"_blank\" rel=\"noreferrer noopener\"><strong>AR0145CSSM00SMKA0-CP2 <\/strong><\/a>&nbsp;<\/p>\n\n\n\n<p class=\"has-text-align-center\"><strong>See the video or read the full transcript below.<\/strong><\/p>\n\n\n\n<details class=\"wp-block-details is-layout-flow wp-block-details-is-layout-flow\"><summary>Toggle transcript<\/summary>\n<p>Our first stop at Embedded World 2025 took us to the STMicroelectronics booth, where an AI-powered foosball table stole the show! Instead of a traditional match, you&#8217;re teaming up to beat an AI opponent.<\/p>\n\n\n\n<p><strong>STMicroelectronics \u2013 AI-Powered Foosball Table<\/strong><\/p>\n\n\n\n<p>This innovation, created with the University of Catania, combines computer vision, AI, and real-time motor control for an unforgettable experience.<\/p>\n\n\n\n<p>Key tech:<\/p>\n\n\n\n<ol start=\"1\" class=\"wp-block-list\">\n<li>Vision System \u2013 The VD66GY camera tracks the ball in real-time.<\/li>\n\n\n\n<li>AI Processing \u2013 The STM32MP2 microprocessor uses Kalman Filters and AI to predict ball position and create strategies.<\/li>\n\n\n\n<li>Motor Control \u2013 Eight STM32F7 microcontrollers manage motors for precise moves and scoring.<\/li>\n<\/ol>\n\n\n\n<p>To top it off, ToF sensors track goals for accurate scoring. This is foosball like you\u2019ve never seen before!<\/p>\n\n\n\n<p><strong>STMicroelectronics \u2013 STM32N6 with Camera Module<\/strong><\/p>\n\n\n\n<p>This demo featured crisp, lag-free video running on the STM32N6, showcasing how much AI power can fit into a tiny microcontroller.<\/p>\n\n\n\n<p>What makes it unique? It uses the ST Neural-art accelerator\u2014an on-chip neural processing unit designed for ultra-efficient edge AI. Combined with the image sensor module, it enables AI tasks like people counting, pose detection, pixel-level segmentation, and hand landmark tracking\u2014all on a single embedded platform.<\/p>\n\n\n\n<p>The highlight was the Meta-Bounds AR glasses powered by STM32N6, delivering AI-driven experiences for up to 10 hours. This was a powerful demo of real-time vision AI on a microcontroller\u2014all without the use of a heatsink!<\/p>\n\n\n\n<p><strong>NXP \u2013 AI Health Controller (AICHI)<\/strong><\/p>\n\n\n\n<p>At the NXP booth, we explored how smart homes can lead to brighter lives\u2014literally. Their AI-powered healthcare controller stole the spotlight.<\/p>\n\n\n\n<p>It gathers multimodal data from sensors and medical devices\u2014like glucose monitors, ECG patches, and smartwatches\u2014and uses edge AI to detect anomalies and alert caregivers. In one scenario, a person falls at home, and AICHI instantly recognizes the emergency and responds. This system combines <strong>Matter-enabled sensors<\/strong>, <strong>tri-radio connectivity (RW612), i.MX95 MPU, UWB (SR250 UWB) and BLE radios(NHS52S04 BLE)<\/strong> to detect motion, monitor vitals, and pinpoint location.<\/p>\n\n\n\n<p>At the heart is <strong>AICHI<\/strong>, NXP\u2019s AI health controller\u2014bringing proactive, affordable, personalized care to the smart home.<\/p>\n\n\n\n<p><strong>NXP \u2013 Autonomous Energy Management<\/strong><\/p>\n\n\n\n<p>Another demo that caught my eye was this dashboard along the wall with all the home appliances. NXP, in collaboration with partners, showcased autonomous energy management in a Matter-connected smart home. UK-based geo presented SeeZero products\u2014the first Matter-certified Home Energy Management System device and smart thermostat\u2014enabled by NXP\u2019s connectivity solutions. Visitors experienced four simulated energy events, demonstrating AI and Matter&#8217;s role in optimizing energy across appliances, power delivery, and storage. The demo featured a smart energy meter with MCX N and IW416 for in-home communications, and a smart thermostat using RW612 Tri-Radio and i.MX 93 platforms. This was on brand with NXP\u2019s theme of creating brighter lives through smarter energy solutions.<\/p>\n\n\n\n<p><strong>Infineon \u2013 Real-Time Motor Control<\/strong><\/p>\n\n\n\n<p>At Infineon\u2019s booth, we saw a real-time dual-motor control demo on a conveyor belt. It utilized the PSOC Control C3 and XENSIV magnetic position sensor on one side, and PSOC 4000T with ModusToolbox motor control libraries on the other. This setup is ideal for dual PMSM servo drive applications requiring high dynamics and tight synchronization. PSOC 4000T features Multi-Sense technology, integrating CAPSENSE for hover touch, inductive sensing for metallic surfaces, and contactless liquid level sensing. CAPSENSE gestures commanded the motor to operate in specific modes. The conveyor belt even played a two-tune melody, including the European anthem, showcasing its versatility for industrial automation and robotics.\u200b<\/p>\n\n\n\n<p><strong>Infineon \u2013 Smart Climate Control System<\/strong><\/p>\n\n\n\n<p>Infineon\u2019s second demo featured a contactless smart climate control system. It employed gesture control to adjust temperature and fan settings. The system incorporated the XENSIV PAS CO\u2082 sensor, based on photoacoustic spectroscopy, for accurate air quality measurements, enhancing comfort and energy efficiency. A 60 GHz mmWave radar sensor enabled advanced presence and gesture detection. The PSOC Edge E84 microcontroller served as a scalable platform for next-generation smart devices. This all-in-one board demonstrated continuous monitoring of CO\u2082, humidity, and temperature, coupled with advanced gesture sensing using edge AI algorithms and radar technology.<\/p>\n\n\n\n<p><strong>Renesas \u2013 ATLAS Asset Tracking Demo<\/strong><\/p>\n\n\n\n<p>At the Renesas booth, we explored ATLAS\u2014Asset Tracking and Locationing at Scale. This impressive BLE-based system tracked booth staff in real time, with reception screens displaying moving dots, each representing a team member\u2019s live location.<\/p>\n\n\n\n<p>Each person wore a name tag embedded with a DA14592 BLE beacon. Signals were picked up by six ceiling-mounted locators using Angle of Arrival (AoA) triangulation to pinpoint positions with precision.<\/p>\n\n\n\n<p>ATLAS can track over 1,000 tags per locator, making it ideal for large-scale environments like warehouses and industrial facilities. This demo showed how scalable, high-accuracy BLE + AoA can transform real-time asset tracking across industries<\/p>\n\n\n\n<p><strong>Renesas \u2013 Real-Time Video Streaming over Wi-Fi 6<\/strong><\/p>\n\n\n\n<p>Renesas demonstrated a Linux-based MPU streaming real-time video over Wi-Fi 6 to tablets. Using both 2.4 GHz and 5 GHz bands, the 5 GHz stream offered smoother playback due to less interference. The system supports Matter, MQTT, Linux, and FSP, highlighting seamless IoT integration. The Wi-Fi 6 module includes an integrated BLE radio and a complete networking stack, operable in standalone or hosted modes. This demo exemplified low-latency video transmission suitable for smart surveillance, home automation, and industrial monitoring.<\/p>\n\n\n\n<p><strong>Bosch Sensortec \u2013 Edge AI and Smart Sensing<\/strong><\/p>\n\n\n\n<p>Bosch Sensortec impressed with a series of engaging demos. Their \u201cSensing the Future with Edge AI\u201d showcased a miniature smart city, illustrating MEMS sensor applications in urban, industrial, and home settings. A portable air quality monitor, powered by the BMV080\u2014the smallest particulate matter sensor\u2014changed colors to indicate air quality levels. Interactive games demonstrated sensors like the &nbsp;pressure, magnetometer and IMU (BMP581, BMM350, and BHI360) in action. A wearable device featuring the BHI360 smart IMU sensor enabled gesture-based light control, highlighting real-time AI processing on the edge. Bosch\u2019s demos exemplified the integration of AI and MEMS for smarter environments.<\/p>\n\n\n\n<p><strong>onsemi \u2013 Hyperlux ID iToF Depth Sensor<\/strong><\/p>\n\n\n\n<p>At onsemi\u2019s booth, a demo resembling a baggage carousel showcased the Hyperlux ID iToF depth sensor (AF0130). This indirect time-of-flight sensor features on-board depth calculation, providing high accuracy for motion detection. Unlike traditional iToF systems that struggle with moving objects and require external processing, onsemi\u2019s solution handles depth in motion efficiently. Its global shutter architecture captures fast motion without blur, making it ideal for machine vision, logistics, and warehouse automation. For applications requiring precise shape and size measurements, iToF offers an effective solution.<\/p>\n\n\n\n<p><strong>Conclusion<\/strong><\/p>\n\n\n\n<p>That wraps up our tour of Embedded World 2025! From edge AI to ultra-precise sensing, and from smarter homes to next-gen automation, this year\u2019s innovations pushed the boundaries of embedded technology. Whether it was tracking assets at scale, controlling motors with a wave, or playing foosball against a robot, it\u2019s clear that intelligence at the edge is not just the future\u2014it\u2019s already here. Thanks for watching, and I\u2019ll catch you next time on <em>Techventures with Lazina<\/em>!\u200b<\/p>\n\n\n\n<p><\/p>\n\n\n\n<p><a href=\"https:\/\/youtube.com\/playlist?list=PLX6sqqUB8iOi95xy7Ut2kNXNh0uXPdOCQ&amp;si=FWatmk7H-ATBELFF\">Techventures video series<\/a><\/p>\n\n\n\n<div style=\"height:39px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<p class=\"has-text-align-center\"><\/p>\n\n\n\n<p><\/p>\n<\/details>\n\n\n\n<div style=\"height:41px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<p><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Join Lazina as she walks through setting up the evaluation board to monitor VOC levels and demonstrates which products, like nail polish and hand sanitizer, raise VOC readings, highlighting the importance of managing indoor air quality.<\/p>\n","protected":false},"author":1,"featured_media":5876,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[430,12],"tags":[],"class_list":["post-5873","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-semiconductor-and-component-innovation","category-techventures"],"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v27.2 (Yoast SEO v27.2) - https:\/\/yoast.com\/product\/yoast-seo-premium-wordpress\/ -->\n<title>TechVentures with Lazina | Ep 28 - At Embedded World 2025 - TechVentures - Future Electronics Blog<\/title>\n<meta name=\"description\" content=\"Join Lazina on a tour of Embedded World 2025 in this episode of Techventures! 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This year was all about intelligence at the edge.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/\" \/>\n<meta property=\"og:site_name\" content=\"Future Electronics Blog\" \/>\n<meta property=\"article:published_time\" content=\"2025-04-30T19:00:00+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2026-02-12T19:35:55+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.futureelectronics.com\/blog\/wp-content\/uploads\/2025\/04\/EW-landing-page-1300x400-1.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"1300\" \/>\n\t<meta property=\"og:image:height\" content=\"400\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"Future Electronics\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Future Electronics\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"6 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"TechArticle\",\"@id\":\"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/#article\",\"isPartOf\":{\"@id\":\"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/\"},\"author\":{\"name\":\"Future Electronics\",\"@id\":\"https:\/\/www.futureelectronics.com\/blog\/#\/schema\/person\/fecd05518d14ba3c6bd888e477105d92\"},\"headline\":\"TechVentures with Lazina | Ep 28 &#8211; At Embedded World 2025\",\"datePublished\":\"2025-04-30T19:00:00+00:00\",\"dateModified\":\"2026-02-12T19:35:55+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/\"},\"wordCount\":1302,\"publisher\":{\"@id\":\"https:\/\/www.futureelectronics.com\/blog\/#organization\"},\"image\":{\"@id\":\"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.futureelectronics.com\/blog\/wp-content\/uploads\/2025\/04\/EW-landing-page-1300x400-1.jpg\",\"articleSection\":[\"Semiconductor and Component Innovation\",\"TechVentures\"],\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/\",\"url\":\"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/\",\"name\":\"TechVentures with Lazina | Ep 28 - At Embedded World 2025 - TechVentures - Future Electronics Blog\",\"isPartOf\":{\"@id\":\"https:\/\/www.futureelectronics.com\/blog\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.futureelectronics.com\/blog\/wp-content\/uploads\/2025\/04\/EW-landing-page-1300x400-1.jpg\",\"datePublished\":\"2025-04-30T19:00:00+00:00\",\"dateModified\":\"2026-02-12T19:35:55+00:00\",\"description\":\"Join Lazina on a tour of Embedded World 2025 in this episode of Techventures! This year was all about intelligence at the edge.\",\"breadcrumb\":{\"@id\":\"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/#primaryimage\",\"url\":\"https:\/\/www.futureelectronics.com\/blog\/wp-content\/uploads\/2025\/04\/EW-landing-page-1300x400-1.jpg\",\"contentUrl\":\"https:\/\/www.futureelectronics.com\/blog\/wp-content\/uploads\/2025\/04\/EW-landing-page-1300x400-1.jpg\",\"width\":1300,\"height\":400},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Blog\",\"item\":\"https:\/\/www.futureelectronics.com\/blog\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"TechVentures\",\"item\":\"https:\/\/www.futureelectronics.com\/blog\/techventures\/\"},{\"@type\":\"ListItem\",\"position\":3,\"name\":\"TechVentures with Lazina | Ep 28 &#8211; At Embedded World 2025\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/www.futureelectronics.com\/blog\/#website\",\"url\":\"https:\/\/www.futureelectronics.com\/blog\/\",\"name\":\"Future Electronics Blog\",\"description\":\"Get inspired on the latest electronic component innovations\",\"publisher\":{\"@id\":\"https:\/\/www.futureelectronics.com\/blog\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/www.futureelectronics.com\/blog\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\/\/www.futureelectronics.com\/blog\/#organization\",\"name\":\"Future Electronics\",\"url\":\"https:\/\/www.futureelectronics.com\/blog\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/www.futureelectronics.com\/blog\/#\/schema\/logo\/image\/\",\"url\":\"https:\/\/www.futureelectronics.com\/blog\/wp-content\/uploads\/2021\/07\/The-Current-Logo-V.png\",\"contentUrl\":\"https:\/\/www.futureelectronics.com\/blog\/wp-content\/uploads\/2021\/07\/The-Current-Logo-V.png\",\"width\":1473,\"height\":901,\"caption\":\"Future Electronics\"},\"image\":{\"@id\":\"https:\/\/www.futureelectronics.com\/blog\/#\/schema\/logo\/image\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\/\/www.futureelectronics.com\/blog\/#\/schema\/person\/fecd05518d14ba3c6bd888e477105d92\",\"name\":\"Future Electronics\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/secure.gravatar.com\/avatar\/6942ea8fb0edf3be7acce9c1378c121f1f99df4c3a9a4482585e04a708ac7990?s=96&d=mm&r=g\",\"url\":\"https:\/\/secure.gravatar.com\/avatar\/6942ea8fb0edf3be7acce9c1378c121f1f99df4c3a9a4482585e04a708ac7990?s=96&d=mm&r=g\",\"contentUrl\":\"https:\/\/secure.gravatar.com\/avatar\/6942ea8fb0edf3be7acce9c1378c121f1f99df4c3a9a4482585e04a708ac7990?s=96&d=mm&r=g\",\"caption\":\"Future Electronics\"},\"sameAs\":[\"https:\/\/futureelecblog.wpengine.com\"],\"url\":\"https:\/\/www.futureelectronics.com\/blog\/author\/futureelecblog\/\"}]}<\/script>\n<!-- \/ Yoast SEO Premium plugin. -->","yoast_head_json":{"title":"TechVentures with Lazina | Ep 28 - At Embedded World 2025 - TechVentures - Future Electronics Blog","description":"Join Lazina on a tour of Embedded World 2025 in this episode of Techventures! This year was all about intelligence at the edge.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/","og_locale":"en_US","og_type":"article","og_title":"TechVentures with Lazina | Ep 28 - At Embedded World 2025","og_description":"Join Lazina on a tour of Embedded World 2025 in this episode of Techventures! This year was all about intelligence at the edge.","og_url":"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/","og_site_name":"Future Electronics Blog","article_published_time":"2025-04-30T19:00:00+00:00","article_modified_time":"2026-02-12T19:35:55+00:00","og_image":[{"width":1300,"height":400,"url":"https:\/\/www.futureelectronics.com\/blog\/wp-content\/uploads\/2025\/04\/EW-landing-page-1300x400-1.jpg","type":"image\/jpeg"}],"author":"Future Electronics","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Future Electronics","Est. reading time":"6 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"TechArticle","@id":"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/#article","isPartOf":{"@id":"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/"},"author":{"name":"Future Electronics","@id":"https:\/\/www.futureelectronics.com\/blog\/#\/schema\/person\/fecd05518d14ba3c6bd888e477105d92"},"headline":"TechVentures with Lazina | Ep 28 &#8211; At Embedded World 2025","datePublished":"2025-04-30T19:00:00+00:00","dateModified":"2026-02-12T19:35:55+00:00","mainEntityOfPage":{"@id":"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/"},"wordCount":1302,"publisher":{"@id":"https:\/\/www.futureelectronics.com\/blog\/#organization"},"image":{"@id":"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/#primaryimage"},"thumbnailUrl":"https:\/\/www.futureelectronics.com\/blog\/wp-content\/uploads\/2025\/04\/EW-landing-page-1300x400-1.jpg","articleSection":["Semiconductor and Component Innovation","TechVentures"],"inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/","url":"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/","name":"TechVentures with Lazina | Ep 28 - At Embedded World 2025 - TechVentures - Future Electronics Blog","isPartOf":{"@id":"https:\/\/www.futureelectronics.com\/blog\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/#primaryimage"},"image":{"@id":"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/#primaryimage"},"thumbnailUrl":"https:\/\/www.futureelectronics.com\/blog\/wp-content\/uploads\/2025\/04\/EW-landing-page-1300x400-1.jpg","datePublished":"2025-04-30T19:00:00+00:00","dateModified":"2026-02-12T19:35:55+00:00","description":"Join Lazina on a tour of Embedded World 2025 in this episode of Techventures! This year was all about intelligence at the edge.","breadcrumb":{"@id":"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/#primaryimage","url":"https:\/\/www.futureelectronics.com\/blog\/wp-content\/uploads\/2025\/04\/EW-landing-page-1300x400-1.jpg","contentUrl":"https:\/\/www.futureelectronics.com\/blog\/wp-content\/uploads\/2025\/04\/EW-landing-page-1300x400-1.jpg","width":1300,"height":400},{"@type":"BreadcrumbList","@id":"https:\/\/www.futureelectronics.com\/blog\/techventures\/techventures-with-lazina-ep-28-at-embedded-world-2025\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Blog","item":"https:\/\/www.futureelectronics.com\/blog\/"},{"@type":"ListItem","position":2,"name":"TechVentures","item":"https:\/\/www.futureelectronics.com\/blog\/techventures\/"},{"@type":"ListItem","position":3,"name":"TechVentures with Lazina | Ep 28 &#8211; At Embedded World 2025"}]},{"@type":"WebSite","@id":"https:\/\/www.futureelectronics.com\/blog\/#website","url":"https:\/\/www.futureelectronics.com\/blog\/","name":"Future Electronics Blog","description":"Get inspired on the latest electronic component innovations","publisher":{"@id":"https:\/\/www.futureelectronics.com\/blog\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.futureelectronics.com\/blog\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.futureelectronics.com\/blog\/#organization","name":"Future Electronics","url":"https:\/\/www.futureelectronics.com\/blog\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.futureelectronics.com\/blog\/#\/schema\/logo\/image\/","url":"https:\/\/www.futureelectronics.com\/blog\/wp-content\/uploads\/2021\/07\/The-Current-Logo-V.png","contentUrl":"https:\/\/www.futureelectronics.com\/blog\/wp-content\/uploads\/2021\/07\/The-Current-Logo-V.png","width":1473,"height":901,"caption":"Future Electronics"},"image":{"@id":"https:\/\/www.futureelectronics.com\/blog\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/www.futureelectronics.com\/blog\/#\/schema\/person\/fecd05518d14ba3c6bd888e477105d92","name":"Future Electronics","image":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/secure.gravatar.com\/avatar\/6942ea8fb0edf3be7acce9c1378c121f1f99df4c3a9a4482585e04a708ac7990?s=96&d=mm&r=g","url":"https:\/\/secure.gravatar.com\/avatar\/6942ea8fb0edf3be7acce9c1378c121f1f99df4c3a9a4482585e04a708ac7990?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/6942ea8fb0edf3be7acce9c1378c121f1f99df4c3a9a4482585e04a708ac7990?s=96&d=mm&r=g","caption":"Future Electronics"},"sameAs":["https:\/\/futureelecblog.wpengine.com"],"url":"https:\/\/www.futureelectronics.com\/blog\/author\/futureelecblog\/"}]}},"_links":{"self":[{"href":"https:\/\/www.futureelectronics.com\/blog\/wp-json\/wp\/v2\/posts\/5873","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.futureelectronics.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.futureelectronics.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.futureelectronics.com\/blog\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.futureelectronics.com\/blog\/wp-json\/wp\/v2\/comments?post=5873"}],"version-history":[{"count":0,"href":"https:\/\/www.futureelectronics.com\/blog\/wp-json\/wp\/v2\/posts\/5873\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.futureelectronics.com\/blog\/wp-json\/wp\/v2\/media\/5876"}],"wp:attachment":[{"href":"https:\/\/www.futureelectronics.com\/blog\/wp-json\/wp\/v2\/media?parent=5873"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.futureelectronics.com\/blog\/wp-json\/wp\/v2\/categories?post=5873"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.futureelectronics.com\/blog\/wp-json\/wp\/v2\/tags?post=5873"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}