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DSPIC33CK128MP203-I/M5
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*** Update of FPCN 120102 / Multiple Change Notification ***Revision History: March 23, 2026: Issued final notification. April 14, 2026: Re-issued final notification to update the Lead-Frame material from EFTECH-64T to EFTEC64T. Revised the notification subject, description of change, Qual title and purpose to add DSPIC33CK64MC003, DSPIC33CK32MC003, DSPIC33CK256MC003, DSPIC33CK128MC003 device families. Revised the affected catalog part numbers.Description of Change: Qualification of MMT as an additional assembly site for selected dsPIC33CK32MC103, dsPIC33CK64MC103, dsPIC33CK256MC103, dsPIC33CK128MC103, dsPIC33CK128MC503, dsPIC33CK256MC503, dsPIC33CK128MP203, dsPIC33CK32MP503, dsPIC33CK64MP203, dsPIC33CK64MP503, dsPIC33CK256MP503, dsPIC33CK128MP503, dsPIC33CK32MP203, dsPIC33CK256MP203, dsPIC33CK64MP103, dsPIC33CK32MP103, dsPIC33CH128MP503, dsPIC33CH128MP203, dsPIC33CH64MP203, dsPIC33CH64MP503, DSPIC33CK64MC003, DSPIC33CK32MC003, DSPIC33CK256MC003, and DSPIC33CK128MC003 device families available in 36L UQFN (5x5x0.6mm) package.Reason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site.Estimated First Ship Date: 12 May 2026 (date code: 2620)
Product Category: Digital Signal ControllersDescription of Change: Qualification of MMT as an additional assembly site for selected dsPIC33CK32MC103, dsPIC33CK64MC103, dsPIC33CK256MC103, dsPIC33CK128MC103, dsPIC33CK128MC503, dsPIC33CK256MC503, dsPIC33CK128MP203, dsPIC33CK32MP503, dsPIC33CK64MP203, dsPIC33CK64MP503, dsPIC33CK256MP503, dsPIC33CK128MP503, dsPIC33CK32MP203, dsPIC33CK256MP203, dsPIC33CK64MP103, dsPIC33CK32MP103,dsPIC33CH128MP503, dsPIC33CH128MP203, dsPIC33CH64MP203, and dsPIC33CH64MP503 device families available in 36L UQFN (5x5x0.6mm) package.*ChangesAssembly SiteWire MaterialDie Attach MaterialMolding Compound MaterialLead-Frame MaterialLead-Frame Lead LockReason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site.Estimated First Ship Date: 12 May 2026 (date code: 2620)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change:Microchip has released a new Document for the dsPIC33CK256MP508 Family Silicon Errata and Data Sheet Clarification of devices. Rev Q Document (4/2025)Added silicon revision B5.Added silicon issue 31 (Reset).Reason for Change: To Improve Productivity.Date Document Changes Effective: 30 Apr 2025
Description of Change:Added data sheet clarifications 4 (Pin Diagrams), 5 (High-Speed, 12-Bit Analog-to-Digital Converter (ADC)), 6 (High-Speed Analog Comparator With Slope Compensation DAC), 7 (Oscillator with High-Frequency PLL), 8 (Power-Saving Features), 9 (Controller Area Network (CAN FD) Module), 10 (Inter-Integrated Circuit (I2C)), 11 (Electrical Characteristics) and 12 (Product Identification System).
Microchip has released a new Errata for the dsPIC33CK256MP508 Family Silicon Errata and Data Sheet Clarification of devices.Notification Status: FinalDescription of Change: Added data sheet clarification 3 (Electrical Characteristics).Impacts to Data Sheet: NoneReason for Change: To improve productivityChange Implementation Status: CompleteDate Document Changes Effective: 26 Jan 2023
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
