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Manufacturer Part #
FM25CL64B-DG
FM25CL64B Series 64 kb (8 K x 8) 3.3 V Serial F-RAM Memory - TDFN-8
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| Mfr. Name: | Infineon | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:81 per Tube Package Style:DFN-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Infineon FM25CL64B-DG - Product Specification
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Detailed change information:Several changes affecting the 4-Kbit to 256-Kbit Industrial Grade F-RAM productsReason/Motivation:New design revision that incorporates advantages of Infineon?s Excelon? architecture to the 4-Kbit to 64-Kbit devices. Migrating to the new die revision will enable customers to benefit from continued product supply and long term technical support on these products.Ensure delivery capability by establishing alternative assembly and packaging components to assure continuity of supply and enable flexible manufacturing.Due to continuously raising demand for Infineon F-RAM products, we have extended our final test capacity to Greatek Taiwan as additional location of our BE test cluster, to assure continuity of supply.
Detailed change information:Several changes affecting the 4-Kbit to 256-Kbit Industrial Grade F-RAM productsReason/Motivation:New design revision that incorporates advantages of Infineon?s Excelon? architecture to the 4-Kbit to 64-Kbit devices. Migrating to the new die revision will enable customers to benefit from continued product supply and long term technical support on these products.Ensure delivery capability by establishing alternative assembly and packaging components to assure continuity of supply and enable flexible manufacturing.Due to continuously raising demand for Infineon F-RAM products, we have extended our final test capacity to Greatek Taiwan as additional location of our BE test cluster, to assure continuity of supply.
Description:Several changes affecting the 4-Kbit to 256-Kbit Industrial Grade F-RAM productsReason:New design revision that incorporates advantages of Infineon?s Excelon? architecture to the 4 Kb to 64 Kb devices. Migrating to the new die revision will enable customers to benefit from continued product supply and long termtechnical support on these products. Ensure delivery capability by establishing alternative assembly and packagingcomponents to assure continuity of supply and enable flexible manufacturing.Due to continuously raising demand for Infineon FRAM products, we have extended our final test capacity to Greatek Taiwan as additional location of our BEtest cluster, to assure continuity of supply.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=EU&field16=en&field2=FM25CL64B-DG&field4=Infineon&field18=https://p1emea.futureelectronics.com/es/p/semiconductors--memory--RAM--nvram--fram-mram/fm25cl64b-dg-infineon-8003465
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=EU&field16=en&field2=FM25CL64B-DG&field4=Infineon&field18=https://p1emea.futureelectronics.com/es/p/semiconductors--memory--RAM--nvram--fram-mram/fm25cl64b-dg-infineon-8003465
Infineon FM25CL64B-DG - Technical Attributes
| FRAM Type: | Non Volatile |
| Memory Density: | 64kb |
| Interface Type: | SPI |
| Memory Organization: | 8K x 8 |
| Supply Voltage-Nom: | 2.7V to 3.65V |
| Temperature Range: | -40°C to +85°C |
| Supply Current: | 3mA |
| Power Dissipation: | 1W |
| Storage Temperature Range: | -65°C to +125°C |
| No of Terminals: | 8 |
| Moisture Sensitivity Level: | 3 |
| Package Style: | DFN-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
81 per Tube
Package Style:
DFN-8
Mounting Method:
Surface Mount