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PIC16F77-I/L
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27 per Tube
PLCC-44
Surface Mount
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COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
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Description of Change: Qualification of 3280NP as an additional die attach material for selected PIC16Cxx, PIC17Cxx, PIC18Fxx, PIC18Cxx, A40MX0xx, AT89C5xx, TC7117xx, TC7106xx, TC7107xx, TC850xx, TC7116xx, TC7109xx, PIC16Fxx, AY0438xx, HV518xx, HV5222xx, HV5308xx, HV9308xx, HV9408xx, HV5408xx, TC7129xx, MM5450xx, MM5451xx, ATF150xx, AT80C5xx, AT89LPxx, AT89S5xx, AT89LSxx, AT89S8xx, ATF250xx, AT27BVxx, AT27C2xx, MT8812xx, MT8816xx, MT093xx, HV5122xx, AT27C1xx, AT27C4xx, HV5622xx, HV5630xx, LE58QLxx, ATmega8515, ATF16Lxx, AT17LVxx, ATF16Vxx, TC1443xx, HV5812xx, HV2022xx, HV2301xx, HV2201xx, HV219xx, ATF22Vxx, ATF750xx, MIC58Pxx, MIC59Pxx, MIC580xx, ATF22Lxx, SY100Exx, MT8952xx, MT9171xx, MT9172xx, MT9122xx, MT8808xx, MT8806xx, COM200xx, A42MX2xx, A42MX0xx, A42MX1xx, AT27C0xx, AT27LVxx, AT28C0xx, AT28LVxx, AT28HCxx, AT28C2xx, AT28BVxx, AT28C6xx, AT27C5xx, SST39Sxx, SST39Lxx, SST39Vxx, SST49Lxx and LE79R7xx device families available in various packages.Reason for Change: To improve manufacturability by qualifying 3280NP as an additional die attach material.Change Implementation Status: In ProgressEstimated Qualification Completion Date: June 2026
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Part Status:
The PIC16F77-I/L 8-bit Microcontroller has 14 K of Flash Program Memory with 33 I/O's. It's maximum CPU speed is 20 MHz with an operating voltage range of 2 V - 5.5 V in a 44-Pin PLCC package. It has an industrial temperature range of -40°C to +85°C and is lead free.
This powerful (200 nanosecond instruction execution) yet easy-to-program (only 35 single word instructions) CMOS FLASH-based 8-bit microcontroller packs Microchip's powerful PIC® architecture into an 40- or 44-pin package and is upwards compatible with the PIC16C5X, PIC12CXXX and PIC16C7X devices. The PIC16F77 features 8 channels of 8-bit Analog-to-Digital (A/D) converter with 2 additional timers, 2 capture/compare/PWM functions and the synchronous serial port can be configured as either 3-wire Serial Peripheral Interface (SPI™) or the 2-wire Inter-Integrated Circuit (I²C™) bus and a Universal Asynchronous Receiver Transmitter (USART).
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Applications:
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