text.skipToContent text.skipToNavigation
Product Variant Information section
Product Specification Section
Pricing Section

Stock : 975

Sur commande : 0
Stock d'usine :Stock d'usine : 0
Délai d'usine : N/A
Commande minimale : 1
Multiples de : 1
Quantité Prix Internet
1 $0.875
100 $0.73
250 $0.705
500 $0.685
1 000+ $0.67
Total :

0,88 $

Attributes Table
Thermal Resistance 5°C/W
Material Aluminum / Black Anodized
Dimension H  6.4mm x L  27.9mm x W  27.9mm
Fonctionnalités et applications

The 658-25AB is a part of 658 series Omnidirectional pin fin heat sink for BGAs and PowerPC™, all of the heat sinks are available with any of the following thermal tape and interface materials, pre-applied at the factory. Use the “T” series, thermally enhanced, pressure sensitive adhesives to attach the heat sink to the electronic package and provide a good thermal link to the heat sink. The “S” series interface materials have adhesives on only one side, for pre-attachment to the heat sink, and provide superior thermal performance.


  • None of theses materials are for use in applciations requireing electrical isolation form electronic devices. All options other than -T1 and -T4 are RoHS Compliant
  • To obtain the estimated thermal resistance of the interface material in your application, divide the thermal impedance value by the area of the pad in square inches. For example, a 2” x 2” piece of T4 has a resistance of 1.10 C-in^2/W divide by 4 in^2=0.275 C/W

Learn more about the 658 series of Heat sinks