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Référence fabricant
IM828XCCXKMA1
IM828XCC Series 35 A 1200 V Three Phase Intelligent Power Module - DIP-24
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| Nom du fabricant: | Infineon | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1 par Bulk Style d'emballage :DIP-24 Méthode de montage :Through Hole | ||||||||||
| Code de date: | |||||||||||
Infineon IM828XCCXKMA1 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Subject Introduction of an additional wafer production siteReason Expansion of wafer production to assure continuity of supply and enable flexible manufacturing.Description OldWafer production and test site for 1200V diodesInfineon TechnologiesAustria AG, VillachWafer production site for 1200V gatedriversFraunhofer-Institut f�rMikroelektronischeSchaltungen und SystemeIMS, Duisburg, GermanyNewInfineon Technologies(Kulim) Sdn. Bhd., KulimorInfineon TechnologiesAustria AG, VillachInfineon Technologies(Kulim) Sdn. Bhd., KulimorFraunhofer-Institut f�rMikroelektronischeSchaltungen und SystemeIMS, Duisburg, GermanyImpact of change No Impact on parameters and reliability as proven via product qualification. Processes are optimized to meet identical product performance according to already applied Infineon specifications.Time schedule? Final qualification report 31-05-2022? First samples available 31-03-2022? Intended start of delivery 01-06-2022 or earlier on specific customer request
Statut du produit:
Infineon IM828XCCXKMA1 - Caractéristiques techniques
| Input Voltage: | 13.5V to 18.5V |
| Output Current: | 35A |
| Frequency Range: | 80kHz |
| No of Terminals: | 24 |
| Style d'emballage : | DIP-24 |
| Méthode de montage : | Through Hole |
Emballages disponibles
Qté d'emballage(s) :
1 par Bulk
Style d'emballage :
DIP-24
Méthode de montage :
Through Hole