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Référence fabricant
R5F1037AANA#W5
RL78/G12 Series 16 kB Flash 1.5 kB RAM 24 MHz 16-Bit Microcontroller - HWQFN-40
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| Nom du fabricant: | Renesas | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :2500 par Reel Style d'emballage :WQFN-40 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 1952 | ||||||||||
Renesas R5F1037AANA#W5 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
UPDATE : Slight changes on document MCP-AB-20-0061 R1. Changes are highlighted in redRefer to Future PCN 74866Description of Change : New assembly and test factories Reason for Change: For RL78 MCU products, Renesas continuously adds manufacturing factories and changes assembly materials for stable supply. For HWQFN package products, manufacturing factories and assembly materials are changed this time.
Overview: The purpose of this notification is to communicate an update to a previously released REA notification (P2007039) released in July 2020. Dimensions in appendices I and S to W have been updated. The original notification announced the following assembly changes for selected RL78 devices in the HWQFN package. Please see the Appendix for additional details on all changes. 1. Bond Wire Change from Gold (Au) to Copper (Cu) 2. Lead Frame, Die Mount Material, & Mold Resin Material Change 3. Assembly Site & Sorting Site Change 4. Package Outline Change 5. Marking Change 6. Packing Material Change (tray and tape & reel) 7. Storage Condition Change (after opening) There is a change to the part number. There is no change to electrical characteristics or product reliability. Key Dates: Shipments from REA of replacement devices begins. September 1, 2020 Final last time buy (LTB) orders of original part number placed to REA or to a franchised REA distributor. June 15, 2021 Planned date for last time shipment (LTS) from REA. December 31, 2021
This notification announces the following assembly changes for selected RL78 devices in the HWQFN package. 1. Bond Wire Change from Gold (Au) to Copper (Cu) 2. Lead Frame, Die Mount Material, & Mold Resin Material Change 3. Assembly Site & Sorting Site Change 4. Package Outline Change 5. Marking Change 6. Packing Material Change (tray and tape & reel) 7. Storage Condition Change (after opening) There is a change to the part number. There is no change to electrical characteristics or product reliability. Final last time buy (LTB) orders of original part number placed to REA or to a franchised REA distributor: June 15, 2021 Planned date for last time shipment (LTS) from REA.: December 31, 2021
Details of Change: 1) Factory 1-1) Assembly factory: Current: Amkor Technology Japan Kumamoto/Hakodate (ATJ Kumamoto/Hakodate) New: Powertech Technology Inc., Group_Greatek Electronics Inc., (PTI_Greatek) 1-2) Sorting factory: Current: Amkor Technology Japan Kumamoto (ATJ Kumamoto) New: King Yuan Electronics Co., Ltd (KYEC) 2) Material: Standard materials are used in new factory 2-1) Bonding wire change to Copper (Cu) 2-2) Lead frame, Die mount material and mold resin material change 2-3) Material Declaration Sheet may be provided upon request3) Package outline: There are some changes in dimensions. The package surface becomes matte but does not affect the reliability. 4) Marking on package 4-1) Font change 4-2) Manufacturing lot number change (from 9 digit to 7 digit) 4-3) Delete country of origin indication 5) Packaging material: 5-1) Tray and the order of devices change 5-2) Addition of bundling band color (Black) 5-3) Emboss tape change 5-4) Reel for emboss taping change 6) Storage condition after opening: Current product: Amkor Technology Japan: Within 30�C/ 70%RH/ 168h New product: Powertech Technology Inc., Group: Within 30�C/ 60%RH/ 168h (JEDEC compliant)
Addition of assembly factory and sorting factory, and change of material for RL78 - Refer to to Supplier PCN MCP-AC-20-0006Change description: 1.Material: Standard materials are used in new factory. 1.1 Bonding wire change: from Gold (Au) to Copper (Cu) 1.2 Lead frame, die mount material and mold resin material change.2. Factory 2.1 Assembly factory: Current factory: Amkor Technology Japan Kumamoto/Hakodate (ATJ Kumamoto/Hakodate) New factory: Powertech Technology Inc., Group_Greatek Electronics Inc., (PTI_Greatek) 2.2 Sorting factory: Current factory: Amkor Technology Japan Kumamoto (ATJ Kumamoto) New factory: King Yuan Electronics Co., Ltd (KYEC)3. Package outline: There are changes in some of dimensions. The package surface becomes matte but does not affect the reliability.4. Marking on package 4-1) Font Change 4-2) Manufacturing lot number Change (from 9 digit to 7 digit) 4-3) Delete country of origin indication5. Packaging material: 5-1) Tray and the order of devices change 5-2) Addition of bundling band color (Black) 5-3) Emboss tape change 5-4) Reel for emboss taping change6. Storage condition after opening: Current product: Amkor Technology Japan: Within 30�C/ 70%RH/ 168h New product: Powertech Technology Inc., Group: Within 30�C/ 60%RH/ 168h (JEDEC compliant)7. Ordering P/N: Please see the P/N reference in the attached table for details.At the same time as this change, we will integrate the P/N for industrial applications. P/N that does not exist in ATJ Kumamoto will not be registered for Rainbow PCN event.Request: 1) Please negotiate to get an approval in the end of July/2020For ROM written products, please perform "Specification change procedure" at Bamboo.2) Following schedulePLP will be switched to new P/N sequentially. For current P/N, after the new P/N is released, we will announce the EOL notification at regular EOL every 6 months. Thank you for your understanding.
Change to Cu wire and change factory for RL78 HWQFN package productsLast order date for current P/N: 6/30/2021Description of Change: 1) Material: Standard materials are used in new factory 1-1) Bonding wire change to Copper (Cu) 1-2) Lead frame, Die mount material and Mold resin material change2) Factory 2-1) Assembly factory: Current: Amkor Technology Japan Kumamoto/Hakodate (ATJ Kumamoto/Hakodate) New: Powertech Technology Inc., Group_Greatek Electronics Inc., (PTI_Greatek) 2-2) Sorting factory: Current: Amkor Technology Japan Kumamoto (ATJ Kumamoto) New: King Yuan Electronics Co., Ltd (KYEC)3) Package outline: There are some changes in dimensions. The package surface becomes matte but does not affect the reliability.4) Marking on package 4-1) Font change 4-2) Manufacturing lot number change (from 9 digit to 7 digit) 4-3) Delete country of origin indication5) Packaging material: 5-1) Tray and the order of devices change 5-2) Addition of bundling band color (Black) 5-3) Emboss tape change 5-4) Reel for emboss taping change6) Storage condition after opening: Current product: Amkor Technology Japan: Within 30�C/ 70%RH/ 168h New product: Powertech Technology Inc., Group: Within 30�C/ 60%RH/ 168h (JEDEC compliant)Reason for Change: For RL78 microcomputer products, we continuously add manufacturing factories and change assembly materials for stable supply.For HWQFN package products, manufacturing factories and assembly materials also are changed this time.Publication Date: 6/29/2020Effective Date: 9/1/2020. After approval is obtained, we will respond sequentially.
Statut du produit:
Renesas R5F1037AANA#W5 - Caractéristiques techniques
| Family Name: | RL78/G12 |
| Core Processor: | RL78 |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 16kB |
| RAM Size: | 1.5kB |
| Speed: | 24MHz |
| No of I/O Lines: | 22 |
| InterfaceType / Connectivity: | CSI/I2C/UART/USART |
| Peripherals: | DMA/POR/PWM/Watchdog |
| Number Of Timers: | 8 |
| Supply Voltage: | 1.8V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 11-chx8-bit / 11-chx10-bit |
| Watchdog Timers: | 1 |
| Style d'emballage : | WQFN-40 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
2500 par Reel
Style d'emballage :
WQFN-40
Méthode de montage :
Surface Mount