text.skipToContent text.skipToNavigation



Hirose Electric


Hirose Electric — Connecting Electric Bikes
Offered on two dates:
March 14th & 16th, 2022 | 1:00pm CDT

Connecting Electric Bikes – Miniaturization, Power & Design Flexibility

  • Miniaturization of internal connection required to reduce size of E-Bike components
  • Enhanced connector assembly required as demand for E-Bikes volume rises
  • Robust, locking connectors to withstand vibration during riding
  • Miniaturized designs to improve space saving as well as enhance ​​interior cable management
  • Secure waterproof connectors in order to withstand environmental challenges while riding

Hirose Electric — Optimized Connector Solutions for CE Hardware Designs
December 9th, 2021 | 1:00pm CST

Optimized Connector Solutions for CE Hardware Designs

  • Latest in advanced micro connector solutions for CE and related consumer/professional product designs
  • Small form factor design solutions
  • Integrated shield structures
  • New feature trends

Hirose Electric — Technology Advancements ​​​​​​​in Endoscopes
October 26th & 28th, 2021 | 1:00pm CDT

Technology Advancements ​​​​​​​in Endoscopes – Improving Image Quality, EMI Protection & Design Flexibility

  • Achieving high-definition visual images due to increasing demand of high-speed transmission
  • Miniaturizing interconnect technology to achieve minimal invasiveness
  • Heat dissipation to minimize loss of component’s current-carrying capacity

Hirose Electric — Optimized Test & Antenna Connectors ​​​​​​​for mmWave, 5G
August 17th, 2021 | 1:00pm CDT

Optimized Test & Antenna Connectors ​​​​​​​for mmWave, 5G

  • Need for high freq. test connector solutions for mmWave environments
  • Component and system design/test optimization and support available from Hirose
  • Latest roadmap solutions including leading edge form factor and SI performance series
  • 5G product design, connector requirements examples

June 22nd & 24th, 2021 | 1:00pm CDT

FUTURE ROBOT DESIGNS – New Connectors Improve Board Density, Thermal and Vibration Challenges

  • Managing the circuit board layout when adding more intelligence and functionality to your system
  • Miniaturizing high-speed interconnect with controlled impedance
  • Why higher operating temperature affects component specification
  • Improving performance in high vibration circuit b oar d applications