Four new Renesas RX651 32-bit MCUs enable design engineers to pack more high-performance MCU functionality in a reduced board footprint.
The new MCUs offer two package options:
- A 64-pin, 4.5mm x 4.5mm BGA package which reduces board footprint by 59% compared to an RX651 in a 100-pin LGA
- A 64-pin, 10mm x 10mm LQFP which offers a 49% footprint reduction over a 100-pin LQFP
The MCUs support the security, connectivity and data-handling needs of endpoint devices at the edge of IoT networks.
The RX651 MCUs integrate connectivity, Trusted Secure IP (TSIP), and trusted Flash area protection features to enable Flash firmware updates in the field through secure network communications. The integrated dual-bank Flash memory enables engineers to realize high root-of-trust levels through a combination of:
- TSIP which protects the encryption key
- Encryption hardware accelerators including AES, 3DES, RSA, SHA and a true random number generator
- Code Flash area protection to protect boot code from reprogramming
The dual-bank Flash function makes it easier for manufacturers to execute in-the-field firmware updates securely and reliably.
These small 64-pin MCUs, based on the highperformance RXv2 core and Renesas’ 40nm wafer fabrication process, provide superior performance: they achieve a 520 CoreMark® score at 120MHz. Strong power efficiency is reflected in a 35 CoreMark/mA score as measured by EEMBC® Benchmarks.