System-on-module combines edge processor with Wi-Fi and Bluetooth wireless connectivity

Laird Connectivity

Summit SOM 8M Plus from Laird Connectivity provides security, graphics, and connectivity features needed in smart, connected devices

The new Summit SOM 8M Plus system-on-module (SOM) from Laird Connectivity combines an advanced multi-core applications processor with a wireless system-on-chip (SoC) to provide a compact unit which simplifies the design of secure connected products and speeds time to market.


The Summit SOM 8M Plus is based on the NXP Semiconductors i.MX 8M Plus multi-core applications processor and the NXP 88W8997 wireless SoC. The SOM’s wireless capability includes dual-band 2×2 Wi-Fi® 5 and Bluetooth® 5.3 radios.


The SOM i.MX 8M Plus applications processor provides a versatile combination of a power-efficient quad-core Arm® Cortex®-A53 processor and a Cortex-M7 microcontroller core, enabling powerful heterogeneous multiprocessing. The Cortex-A53 and Cortex-M7 cores enable concurrent execution of Linux® and real-time operating systems on dedicated sub-systems protected behind firewalls. The quad-core i.MX 8M Plus SoC is powerful enough to run multiple instances of Linux software for various purposes, such as user interfaces and connectivity.


Functions which design engineers can implement with the Summit SOM 8M Plus include hardware acceleration for machine learning, enabled by an integrated high-speed neural processing unit. The SOM also contains a DSP core and graphics processing unit for graphics, video, vision, and audio functions.


The array of interfaces includes support for up to three displays and several options for video out, camera and audio inputs, and general I/Os.


A comprehensive security architecture, ideal for today’s connected IoT applications, includes a secure enclave and secure boot. The i.MX 8M Plus processor enables root-of-trust hardware-based software validation, and a high-performance and flexible secure storage system for passwords, certificates, and data storage.


  • Memory options:
    • RAM: 512 Mbytes, 1 Gbyte or 2 Gbytes
    • Storage: 8 Gbytes or 16 Gbytes
  • Interfaces:
    • 2 x USB 3.0/2.0 dual-role with PHY
    • 2 x Gigabit Ethernet with IEEE 1588, AVB
    • 2 x CAN/CAN FD
    • 4 x UART
    • 6 x I2C
    • 3 x SPI
    • SDIO 3.0/eMMC 5.1
  • FCC, IC, CE, RCM, MIC, and Bluetooth SIG approvals
  • Operating-temperature range: -30°C to 85°C


  • Rugged handheld devices
  • Industrial IoT gateways
  • IoT vision solutions
  • Healthcare devices
  • Service robots
  • Drones
  • Fleet analytics
  • Building management systems
  • Audio/voice systems

Development Kit

Board Part Number: 453-00072-K1

The Summit SOM 8M Plus evaluation kit includes reference designs for display, camera, audio, cellular connectivity, GPS, power consumption profiling, Power-over-Ethernet, battery usage, battery charging, USB 3.0 power, and more.

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