Nexperia has introduced a series of dual N-channel MOSFETs – BUK7V4R2-40H and BUK9V13-40H – in a half-bridge configuration which are housed in a compact LFPAK56D package, giving designers a convenient way to reduce board footprint and simplify the board layout compared to the use of two single MOSFETs.
The new Nexperia BUK7V4R2-40H and BUK9V13-40H are AEC-Q101 qualified 40V MOSFETs for use in automotive applications. Nexperia also supplies the PSMN4R2-40VSH and PSMN013-40VLD 40V dual MOSFETs for industrial applications. The MOSFET half-bridge package is also footprint-compatible with the dual Power-SO8 package.
The LFPAK56D half-bridge package offers substantial advantages over a typical half-bridge arrangement composed of discrete MOSFETs in a standard LFPAK package. In a typical three-phase motor with half-bridge drivers, the PCB connection between the source of the high-side MOSFET and the drain of the low-side MOSFET outside the LFPAK package creates parasitic inductance, and occupies space on the PCB.
By contrast, the Nexperia LFPAK56D half-bridge configuration features an internal copper clip connection, creating 60% less parasitic inductance and using 30% less board space, while also freeing up an Output pin. This package format uses flexible leads to improve board-level reliability, and an internal copper clip connection between the MOSFETs simplifies the PCB design and improves current-handling capability.