STMicroelectronics

STMicroelectronics ISM330DHCX Motion Sensor System-in-Package (SiP)

Combined MEMS accelerometer and gyroscope in a single compact package

The ISM330DHCX from STMicroelectronics, a motion sensor system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope, is tailored for Industry 4.0 applications. The micromachined sensing elements of the accelerometer and gyroscope are implemented on the same silicon die, providing superior stability and robustness.

 

The ISM330DHCX has a full-scale acceleration range of ±2g/±4g/±8g/±16g, and features an extended angular rate range up to ±4,000 degrees/s. It offers embedded functions and interrupts including tilt detection, free-fall, wake-up, 6D/4D orientation, click and double-click detection.

 

The design and calibration of the ISM330DHCX have been optimized to provide outstanding accuracy and stability as well as low noise and full data synchronization.

 

A rich set of embedded features includes a machine learning core, FIFO, sensor hub to collect data from external sensors, programmable finite state machine, event decoding and interrupts. The machine learning core is a unique feature which performs motion recognition in Artificial Intelligence (AI) applications. Use of the core provides large reductions in power consumption at the system level compared to other methods of implementing AI.

 

The ISM330DHCX is available in a 14-lead plastic land grid array package measuring 2.5mm x 3.0mm x 0.83mm. ST supplies the product as part of its 10-year longevity program.

Features

  • Embedded pedometer, step detector and counter
  • Embedded self-test
  • Survives severe shocks
  • Embedded compensation for high stability over temperature
  • Supply-voltage range: 1.71V-3.6V
  • Operating-temperature range: -40°C to 105°C

Applications

  • Industrial IoT
  • Optical image and lens stabilization
  • Antennas
  • Platforms
  • Robots
  • Drones
  • Industrial automation equipment
  • Navigation systems
  • Telematics systems
  • Vibration monitoring

Evaluation Board

Board part number: STEVAL-STWINKT1B

 

The STWIN SensorTile wireless industrial node is a development kit and reference design which simplifies the prototyping and testing of advanced industrial IoT applications such as condition monitoring and predictive maintenance.

 

The kit features a core system board with a range of embedded industrial-grade sensors, including the ISM330DHCX. It also features a low-power microcontroller for vibration analysis of motion-sensing data across a wide range of vibration frequencies, including very high-frequency audio and ultrasound spectra, and local temperature and environmental monitoring.

 

The ISM330DHCX can also be evaluated with a combination of the STEVAL-MKI109V3 and the STEVAL-MKI207V1 adapter board.

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