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Manufacturer Part #
ATMEGA16A-AU
ATmega Series 16 KB Flash 1 KB SRAM 16 MHz 8-Bit Microcontroller - TQFP-44
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:160 per Tray Package Style:TQFP-44 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2006 | ||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of Microchip Technology Tempe Fab 2 (TMGR) as an additional fabrication site for selected Atmel products.Due to unforeseen circumstances, that are out of Microchip�s control, full qualification will be made available at a date after shipment as Microchip plans to continue fulfill orders by shipping from the new fabrication site as soon as possible as to not disrupt customer orders. Pre Change: Fabricated at Microchip Technology Colorado Fab 5 (MCSO) using 6 inch waferPost Change:Fabricated at Microchip Technology Colorado Fab 5 (MCSO) using 6 inch wafer or Microchip Technology Tempe Fab 2 (TMGR) using 8 inch wafer Impacts to Data Sheet: None Change Impact:None Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Tempe Fab 2 (TMGR) fabrication site.Due to unforeseen business conditions, Microchip Technology Tempe Fab 2 (TMGR) has been qualified as a additional fabrication site effective immediately. Change Implementation Status:In Progress Estimated First Ship Date:January 11, 2021 (date code: 2103)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Revision History:December 11, 2019: Issued initial notification.January 08, 2020: Re-issued initial notification to update the Qualification Plan and Affected CPN list.January 22, 2020: Re-issued initial notification to revise the Affected CPN list based on the updated scope.Description of Change:Qualification of Microchip Technology Tempe - Fab 2 (TMGR) as an additional fabrication site for selected Atmel products.Pre Change:Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6 inch wafer.Post Change:Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6 inch wafer or Microchip Technology Tempe - Fab 2 (TMGR) using 8 inch wafer.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Tempe - Fab 2 (TMGR) fabrication site.Estimated Qualification Completion Date:June 2020
Description of Change:Qualification of Microchip Technology Gresham Fab 4 (GRTM) as an additional fabrication site for selected Atmel products.Pre Change:Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6 inch wafer.Post Change:Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6inch wafer or Fabricated at Microchip Technology Gresham Fab 4 (GRTM) using 8inch wafer.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication source Microchip Technology Gresham Fab 4 (GRTM).Estimated Qualification Completion Date:June 2020
Revision History:December 11, 2019: Issued initial notification.January 08, 2020: Re-issued initial notification to update the Qualification Plan and Affected CPN list.Description of Change:Qualification of Microchip Technology Tempe - Fab 2 (TMGR) as an additional fabrication site for selected Atmel products.Pre Change:Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6 inch wafer.Post Change:Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6 inch wafer or Microchip Technology Tempe - Fab 2 (TMGR) using 8 inch wafer.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Tempe - Fab 2 (TMGR) fabrication site.
Description of Change:Qualification of Microchip Technology Tempe - Fab 2 (TMGR) as an additional fabrication site for selected Atmel products.Pre Change: Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6 inch wafer.Post Change: Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6 inch wafer or Microchip Technology Tempe - Fab 2 (TMGR) using 8 inch wafer.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Tempe - Fab 2 (TMGR) fabrication site.Estimated Qualification Completion Date: June 2020
Product Category: 8-bit Microcontrollers; Capacitive Touch SensorsNotification subject: CCB 3296 Final PCN: Qualification of gold (Au) bond wire as secondary wire material for selected Atmel products available in 44L TQFP (10x10x1.0mm) package at MTAI Assembly sitePCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of gold (Au) bond wire as secondary wire material for selected Atmel products available in 44L TQFP (10x10x1.0mm) package at MTAI Assembly sitePre Change: Using palladium coated copper wire with gold flash (CuPdAu) bond wirePost Change: Using palladium coated copper wire with gold flash (CuPdAu) or gold (Au) bond wireImpacts to Data Sheet: NoneChange Impact: NoneReason for Change: To improve on-time delivery performance by qualifying gold (Au) bond wire for selected Atmel devices at MTAI assembly site.|Change Implementation Status: In ProgressEstimated First Ship Date: September 07, 2018 (date code: 1836)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Method to Identify Change: Traceability code
Description of Change:Qualification of gold (Au) bond wire as secondary wire material for selected Atmel products available in 44L TQFP (10x10x1.0mm) package at MTAI Assembly site.Pre Change: Using palladium coated copper wire with gold flash (CuPdAu) bond wire.Post Change: Using palladium coated copper wire with gold flash (CuPdAu) or gold (Au) bond wire.Reason for Change:To improve on-time delivery performance by qualifying gold (Au) bond wire for selected Atmel devices at MTAI assembly site.
Product Lifecycle:
Technical Attributes
| Family Name: | ATmega |
| Core Processor: | AVR |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 16kB |
| RAM Size: | 1kB |
| Speed: | 16MHz |
| No of I/O Lines: | 32 |
| InterfaceType / Connectivity: | I2C/SPI/UART/USART |
| Peripherals: | Brown-out Detect/POR/PWM/Reset/Watchdog |
| Number Of Timers: | 3 |
| Supply Voltage: | 2.7V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 8-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | TQFP-44 |
| Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
160 per Tray
Package Style:
TQFP-44
Mounting Method:
Surface Mount
