SAME53 Series 512 kB Flash 192 kB RAM 32-Bit SMT Microcontroller - TQFP-100
ERRATA - SAM D5x/E5x Family Errata and Data Sheet ClarificationDescription of Change: Document Revision G: Addition of silicon die revision D.1) The Errata Summary Table and The affected silicon revision tables in 2. Silicon Errata Issues have been updated to reflect the addition of EFP and Non-EFP silicon revisions. 2) The following Silicon issues were added: a) ADC: - 2.1.4 DMA Sequencing - 2.1.5 DMA Sequencing b) AC: 2.2.2 Output c) DFLL 48: 2.8.4 LLAW d) DAC: 2.9.5 Reference e) RTC: 2.17.6 Prescaler f) SERCOM: -2.18.17 Wakeup - 2.18.18 LENGTH 3) The following Data Sheet Clarifications were added: a) DAC - 85°C b) DAC - 105°C c) DAC - 125°CDocument Revision F:The Silicon errata for Device Operation for Temperature < -20°C was updated with text denoting which silicon versions it applies to.Reason for Change: To Improve Productivity
Microchip has released a new DeviceDoc for the SAM D5x/E5x Family Errata and Data Sheet Clarification of devices.Description of Change:The following Silicon Issues were updated:a. FDPLL: 2.13.1 Low-Frequency Input Clock on FDPLLn Reference:CHIP003-4The following Data Sheet Clarifications were added:a. Update to Initialization, Enabling, Disabling, and Resettingb. Update to Loop Divider Ratio UpdatesReason for Change: To Improve ProductivityDate Document Changes Effective: 07 February 2019NOTE: Please be advised that this is a change to the document only the product has not been changed.
ERRATA - SAM D5x/E5x Family Errata and Data Sheet ClarificationMicrochip has released a new DeviceDoc for the SAM D5x/E5x Family Errata and Data Sheet Clarification of devices.Notification Status: FinalDescription of Change:The following silicon issues were added:1) SERCOM I2C - 2.18.16 SERCOM I2C: Repeated Start2) CAN-FD - 2.4.3 Message Transmitted with Wrong Arbitration and Control Fields - 2.4.4 DAR Mode - 2.4.5 High-Priority Message (HPM) interrupt - 2.4.6 Tx FIFO message sequence inversion3) PDEC - 2.22.1 X2 Mode4) DMAC - 2.10.2 Channel Priority - 2.10.3 DMAC in Debug Mode5) RTC - 2.17.2 COUNTSYNC - 2.17.3 Tamper Input Filter - 2.17.4 Tamper Detection - 2.17.5 Tamper Detection Timestamp6) SUPC - 2.19.2 BOD33 Hysteresis7) TCC - 2.21.3 ALOCK Feature - 2.21.4 LUPD feature in Down-Counting ModeThe following Data Sheet Clarifications were added:1) Table 54-35 Flash Timing Characteristics was updated.2) BOD12 Register Information was updatedImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 23 Nov 2018NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Data Sheet - SAM D5X/E5X Family Datasheet Data Sheet Document RevisionNotification Status: FinalDescription of Change:1) Added ordering information for 105°C and 125°C temperature grade.2) Exposed pad info added for QFN package in Pinout section3) Corrected typographical errors for pin numbers PB19 and PB23 in I/O Multiplexing and Considerations section4) Clarified NVM User Page size in table 9-1.5) Corrected typographical errors in section 10.2.2 Interrupt Line Mapping for SERCOMx interrupt line 7.6) Corrected typographical errors related to R/W bits for 15.8.8 APBA Mask Register7) Updated Figure 18-2 Operating Conditions and SleepWalking to reflect that PL0 is not applicable to this product.8) Updated INTENCLR, INTENSET, INTFLAG, and STATUS Registers to reflect factory preprogramming of BOD12.9) Removed CHIP.ID information as it is not applicable to this product in DMAC section10) Corrected typographical errors in the USERm Register offset.11) In CCL section1. Internal Events Inputs Selection (EVENT) section was updated by removing ASYNCEVENT related information.2. Alternate 2 TC input source not applicable and was removed for LUTCTRL.INSELx bits.12) Added clarification for INTREF to 45.8.6 Reference Control(REFCTRL).13) In TC section1. 48.7.1 Register Summary - 8-bit Mode - Updated register bitfield with indexing to display usage.2. 48.7.2 Register Summary - 16-bit Mode2.1. Updated register bitfield with indexing to display usage.2.2. Removed inapplicable register PER & PERBUF register information.3. 48.7.3 Register Summary - 32-bit Mode3.1. Updated register bitfield with indexing to display usage.3.2. Removed inapplicable register PER & PERBUF register information.14) In TCC - Timer/Counter for Control Applications section1. Table 49-4. Output Matrix Channel Pin Routing Configuration updated to show all supported 6 capture channels.2. Table 49-8. Fault and Capture Action updated by adding missing CAPTMARK value for CAPTURE bit fields.3. Register INTENCLR, INTENSET, INTFLAG updated with missing UFS bit.4. Removed unsupported bit info for the register 49.8.15 Pattern (PATT).5. Missing POLx bits added to the register 49.8.16 Waveform (WAVE).6. 49.7 Register Summary - Updated register bitfield with indexing to display usage.15) In 54. Electrical Characteristics at 85°C section1. Clarified how CLEXT can be computed in section 54.12.1 Crystal Oscillator (XOSC) Characteristics and 54.12.2 External 32 kHz Crystal Oscillator (XOSC32K) Characteristics2. Clarified capacitor requirements in Table 54-18. External Components Requirements in Switching Mode and Table 54-19 Decoupling Requirements.3. Condition shown for VREF parameter is removed in table 54-24. Operating Conditions.4. Conditions specified for table 54-29 Differential Mode is clarified for INL & DNL with Internal voltage reference.5. Table 54-35. Flash Timing Characteristics is updated for Chip Erase maximum time.6. Added the missing note in Table 54-44. UltraLow-Power Internal 32kHz Oscillator Electrical Characteristics.7. Added the missing note in Table 54-48. Fractional Digital Phase Lock Loop Characteristics8. Typo for the maximum value of tMOH in the Table 54-51. SPI Timing Characteristics and Requirements addressed.9. Table 54-53. QSPI Maximum Frequency examples updated.16) Introduced device part numbers with Electrical Characteristics for 105°C temperature grade.17) Introduced device part numbers with Electrical Characteristics for 125°C temperature gradeImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteEstimated First Ship Date: 23 Nov 2018NOTE: Please be advised that this is a change to the document only the product has not been changed.
Notification subject: ERRATA - SAM D5x/E5x Family Errata and Data Sheet ClarificationNotification text: SYST-15TGGB698Microchip has released a new DeviceDoc for the SAM D5x/E5x Family Errata and Data Sheet Clarification of devices. If you are using one of these devices please read the document located at SAM D5x/E5x Family Errata and Data Sheet Clarification.Notification Status: FinalDescription of Change:1) The current device data sheet revision letter was updated.2) The following silicon issues were added:a) Configurable Custom Logic (CCL):- Enable Protected Registers- Sequential Logic Referenceb) Device:- Reverse Current in VDDIOB Domainc) SERCOM:- Repeated Start in Master Write Operation in 10-bit Addressing Mode- Repeated Start in High-Speed Master Write Operation- Repeated Start in High-Speed Master Read Operation- STATUS.CLKHOLD Bit in Master and Slave Modesd) Supply Controller (SUPC):- Buck Converter Modee) TCC:- TCC with EVSYS in SYNC/RESYNC ModeImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 16 Aug 2018NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Microchip has released a new DeviceDoc for the SAM D5x/E5x Family Errata and Data Sheet Clarification of devices.Description of Change: 1) The current device data sheet revision letter was updated2) Added Analog-to-Digital Converter (ADC): Reference Buffer Offset Compensation3) Added Peripheral Access Controller (PAC): PAC Protection 4) Added Real-Time Counter (RTC): Write Corruption5) Added SERCOM-I2C: Slave Mode with DMA, I2C Slave in DATA32B Mode, I2C Slave Mode in 10-bit Address and Repeated Start6) Added SERCOM-SPI: Data Preload7) Added SERCOM-UART:Collision Detection8) All Data Sheet Clarifications were removed.Reason for Change: To Improve ProductivityDate Document Changes Effective: 13 Apr 2018NOTE: Please be advised that this is a change to the document only the product has not been changed.
Description of Change: 1) Features; Updated CAN FD reference. Added 120-ball TFBGA package. 2) Configuration; Summary Added 120-ball TFBGA to the family feature tables. 3) Ordering Information; Updated the notes for devices in WLCSP packages; Updated Package Type, adding CT = TFBGA. 4) Pinout; Added the 120-ball TFBGA package pinout diagram. 5) Multiplexed Signals; Added 120-ball TFBGA and updated Note 3 (see Table 6-1.). 6) OSC32KCTRL - 32 kHz Oscillators Controller; Added the EN1K and EN32K bits to the OSCULP32K register (see 29.8.9 OSCULP32K). 7) SERCOM - Serial Communication Interface; Added Fractional Baud information to the Baud Rate Equations (see Table 33-2). 8) QSPI - Quad Serial Peripheral Interface; Added equations to the BAUD register (see 37.8.3 BAUD). 9) CAN - Control Area Network; Updated the Overview; Updated ISO 11898 references throughout the chapter. 10) Public Key Cryptography Controller (PUKCC); Added the Public Key Cryptography Library (PUKCL) Application Programmer Interface (API) section. 11) TCC - Timer/Counter for Control Applications; Updated the number of TCC instances to 5 (4:0). 12) 54. Electrical Characteristics at 85�C; (1) Improved SPI maximum speed information in Table 54-52.; (2). Added example for QSPI maximum frequency examples Table 54-54.). 12) Packaging Information; Added the 120-ball TFBGA package (see 55.3.6 120-ball TFBGA).Reason for Change: To Improve ManufacturabilityDate Document Changes Effective: 16 Apr 2018
Description of Change: 1) Added Silicon Issue: � Ethernet Functionality in 64-pin Packages 2) Added Data Sheet Clarifications: � ADC Operating Conditions � GMAC IEEE 802.3AZ Energy Efficient Support � SERCOM Baud Rate Equations � SERCOM in SPI Mode Timing � TQFP 64-pin Package � DAC Operating ConditionsReason for Change: To Improve ProductivityDate Document Changes Effective: 09 Oct 2017NOTE: Please be advised that this is a change to the document only the product has not been changed.
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|Core Processor||ARM Cortex M4F|
|Program Memory Type||Flash|
|Flash Size (Bytes)||512kB|
|No of I/O Lines||81|
|InterfaceType / Connectivity||EBI/EMI/Ethernet/IrDA/I2C/LINbus/MMC/QSPI/SD/UART/USART/USB|
|Supply Voltage||1.71V to 3.6V|
|Operating Temperature||-40°C to +85°C|