
Manufacturer Part #
ATTINY85-20SUR
ATtiny Series 8 kB Flash 512 B SRAM 20 MHz 8-Bit Microcontroller - SOIC-8
| |||||||||||
Mfr. Name: | Microchip | ||||||||||
Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:2000 per Reel Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
Date Code: | 2039 |
Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:March 1, 2018: Issued initial notification.March 21, 2018: Re-issued initial notification to update the post change and affected CPN list and to revise this initial notification to be issued to all affected customers.February 12, 2019: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on March 12, 2019.Description of Change: Qualification of MTAI as an additional assembly site for selected Atmel non-automotive products available in 8L SOIJ package.Pre Change: Assembled at LPI using palladium coated copper wire with gold flash (CuPdAu) bond wire, CRM-1033BF die attach material.Post Change: Assembled at LPI using palladium coated copper wire with gold flash (CuPdAu) bond wire, CRM-1033BF die attach material or assembled at MTAI using gold (Au) bond wire and 8390A die attach material.Reason for Change: To improve on-time delivery performance by qualifying MTAI as additional assembly site.Estimated First Ship Date: March 12, 2019 (date code: 1911)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Revision History:March 1, 2018: Issued initial notification.March 21, 2018: Re-issued initial notification to update the post change and affected CPN list and to revised this initial notification to be issued to all affected customers.Description of Change:Qualification of MTAI as an additional assembly site for selected Atmel products available in 8L SOIJ package.Pre Change:Assembled in LPI using palladium coated copper wire with gold flash (CuPdAu) bond wire, CRM-1033BF die attach material.Post Change:Assembled in LPI using palladium coated copper wire with gold flash (CuPdAu) bond wire, CRM-1033BF die attach material and assembled in MTAI using gold (Au) bond wire and 8390A die attach material.Reason for Change:To improve on-time delivery performance by qualifying MTAI as additional assembly site.Estimated Qualification Completion Date:April 2018
Revision History:March 1, 2018: Issued initial notification.March 21, 2018: Re-issued initial notification to update the post change and affected CPN list and to revised this initial notification to be issued to all affected customers.Description of Change:Qualification of MTAI as an additional assembly site for selected Atmel products available in 8L SOIJ package.Pre Change: Assembled in LPI using palladium coated copper wire with gold flash (CuPdAu) bond wire, CRM-1033BF die attach material.Post Change:Assembled in LPI using palladium coated copper wire with gold flash (CuPdAu) bond wire, CRM-1033BF die attach material and assembled in MTAI using gold (Au) bond wire and 8390A die attach material Reason for Change:To improve on-time delivery performance by qualifying MTAI as additional assembly site.
Description of Change:Qualification of MTAI as an additional assembly site for selected Atmel products available in 8L SOIJ package.Pre Change:Assembled in LPI using palladium coated copper wire with gold flash (CuPdAu) bond wire, CRM- 1033BF die attach material.Post Change:Assembled in MTAI using gold (Au) bond wire and 8390A die attach material.Reason for Change:To improve on-time delivery performance by qualifying MTAI as additional assembly site. Estimated Qualification Completion Date:April 2018
Product Lifecycle:
Technical Attributes
Family Name: | ATtiny |
Core Processor: | AVR |
Program Memory Type: | Flash |
Flash Size (Bytes): | 8kB |
RAM Size: | 512B |
Speed: | 20MHz |
No of I/O Lines: | 6 |
InterfaceType / Connectivity: | SPI/USI |
Peripherals: | Brown-out Detect/POR/PWM/Reset/Watchdog |
Supply Voltage: | 2.7V to 5.5V |
Operating Temperature: | -40°C to +85°C |
On-Chip ADC: | 4-chx10-bit |
Watchdog Timers: | 1 |
Package Style: | SOIC-8 |
Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
2000 per Reel
Package Style:
SOIC-8
Mounting Method:
Surface Mount