Manufacturer Part #
AT42QT1481-AUR
AT42QT1481: 5.25 V 13 mA 48-Key QMatrix FMEA IEC/EN60730 Touch Sensor IC TQFP-44
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:2000 per Reel Package Style:TQFP-44 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 1920 | ||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:December 11, 2019: Issued initial notification.January 08, 2020: Re-issued initial notification to update the Qualification Plan and Affected CPN list.January 22, 2020: Re-issued initial notification to revise the Affected CPN list based on the updated scope.Description of Change:Qualification of Microchip Technology Tempe - Fab 2 (TMGR) as an additional fabrication site for selected Atmel products.Pre Change:Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6 inch wafer.Post Change:Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6 inch wafer or Microchip Technology Tempe - Fab 2 (TMGR) using 8 inch wafer.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Tempe - Fab 2 (TMGR) fabrication site.Estimated Qualification Completion Date:June 2020
Description of Change:Qualification of Microchip Technology Gresham Fab 4 (GRTM) as an additional fabrication site for selected Atmel products.Pre Change:Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6 inch wafer.Post Change:Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6inch wafer or Fabricated at Microchip Technology Gresham Fab 4 (GRTM) using 8inch wafer.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication source Microchip Technology Gresham Fab 4 (GRTM).Estimated Qualification Completion Date:June 2020
Revision History:December 11, 2019: Issued initial notification.January 08, 2020: Re-issued initial notification to update the Qualification Plan and Affected CPN list.Description of Change:Qualification of Microchip Technology Tempe - Fab 2 (TMGR) as an additional fabrication site for selected Atmel products.Pre Change:Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6 inch wafer.Post Change:Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6 inch wafer or Microchip Technology Tempe - Fab 2 (TMGR) using 8 inch wafer.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Tempe - Fab 2 (TMGR) fabrication site.
Description of Change:Qualification of Microchip Technology Tempe - Fab 2 (TMGR) as an additional fabrication site for selected Atmel products.Pre Change: Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6 inch wafer.Post Change: Fabricated at Microchip Technology Colorado - Fab 5 (MCSO) using 6 inch wafer or Microchip Technology Tempe - Fab 2 (TMGR) using 8 inch wafer.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Tempe - Fab 2 (TMGR) fabrication site.Estimated Qualification Completion Date: June 2020
Product Category: 8-bit Microcontrollers; Capacitive Touch SensorsNotification subject: CCB 3296 Final PCN: Qualification of gold (Au) bond wire as secondary wire material for selected Atmel products available in 44L TQFP (10x10x1.0mm) package at MTAI Assembly sitePCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of gold (Au) bond wire as secondary wire material for selected Atmel products available in 44L TQFP (10x10x1.0mm) package at MTAI Assembly sitePre Change: Using palladium coated copper wire with gold flash (CuPdAu) bond wirePost Change: Using palladium coated copper wire with gold flash (CuPdAu) or gold (Au) bond wireImpacts to Data Sheet: NoneChange Impact: NoneReason for Change: To improve on-time delivery performance by qualifying gold (Au) bond wire for selected Atmel devices at MTAI assembly site.|Change Implementation Status: In ProgressEstimated First Ship Date: September 07, 2018 (date code: 1836)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Method to Identify Change: Traceability code
Description of Change:Qualification of gold (Au) bond wire as secondary wire material for selected Atmel products available in 44L TQFP (10x10x1.0mm) package at MTAI Assembly site.Pre Change: Using palladium coated copper wire with gold flash (CuPdAu) bond wire.Post Change: Using palladium coated copper wire with gold flash (CuPdAu) or gold (Au) bond wire.Reason for Change:To improve on-time delivery performance by qualifying gold (Au) bond wire for selected Atmel devices at MTAI assembly site.
Product Lifecycle:
-
ROHS Compliant -
Lead Free
Technical Attributes
| Type: | Capacitive |
| Supply Voltage: | 4.75V to 5.25V |
| Supply Current: | 13mA |
| Interface: | Serial |
| Capacitance: | 0pF to 20pF |
| Operating Temp Range: | -40°C to +105°C |
| Storage Temperature Range: | -55°C to +125°C |
| No of Terminals: | 44 |
| Moisture Sensitivity Level: | 3 |
| Package Style: | TQFP-44 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
2000 per Reel
Package Style:
TQFP-44
Mounting Method:
Surface Mount
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