Manufacturer Part #
Addendum to PCN200902 - Qualification of PTI-SG as an Additional Bumping, Wafer Sort, Backend and Finish Site for Select WLCSP Products Description of Change: The purpose of this addendum is to announce that Cypress, an Infineon Technologies Company has decided to not pursue the qualification of Powertech Technology Inc. (PTI-SG - 12 Ang Mo Kio Street 65, Singapore 569060) as an additional bumping, wafer sort, backend and finish site due to their decision to shut down the plant by end of December 2020. Twenty-six (26) products listed in attached list identified with a "Note 1" have not and will not be run as production in Powertech Technology Inc. (PTI-SG - 12 Ang Mo Kio Street 65, Singapore 569060) due to plant closure.
Description of Change: Cypress announces the qualification of Powertech Technology Inc. (PTI-SG - 12 Ang Mo Kio Street 65, Singapore 569060) as an additional bumping, wafer sort, backend and finish site for select WLCSP products. PTI-SG is the only 300mm wafer bumping facility in Singapore. This qualification will allow Cypress to leverage PTI-SG's manufacturing expertise and quality focus. PTI-SG is certified on several international quality standards: IATF16949, ISO9001, ISO14001 and OHSAS18001. Cypress also announces the qualification of an alternate source for carrier tape and cover tape for the select WLCSP products. ? No changes in carrier tape dimensions and materials for all the affected packages except a minor improvement on Ao. Bo & Ko for WLCSP151 4.91x5.85x0.55 mm. Refer to attachment for drawing 151-Ball WLCSP (4.91x5.85x0.55 mm). ? Cover tape type changed from pressure seal to heat seal. Benefit of Change: Qualification of alternate manufacturing sites is part of the ongoing flexible manufacturing initiative announced by Cypress. The goal of the flexible manufacturing initiative is to provide the means for Cypress to continue to meet delivery commitments through dynamic, changing market conditions.
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.