Manufacturer Part #
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
Description of Alert: PSoC� 1 and derivative devices began shipping in 2002, and over time they have been successfully used in a broad spectrum of applications. Unfortunately, it has recently been discovered that a skilled hacker with physical possession of a device and specific hardware and software tools can use the device in a manner not intended, and extract the data stored in Flash in circumvention of the ProtectBlock feature. Cypress is issuing this PIN to notify our customers about the recent event. PSoC� 1 and derivative devices offer external access and control of device resources through a debug/programming mode which uses the In-system Serial Programming Protocol (ISSP). If the designer chooses, it is possible to prevent external read and write access of Flash during this mode by using the ProtectBlock feature. However, the feature does not block access to SRAM memory. As a result, it is possible to circumvent the ProtectBlock feature by conducting system operations on Flash (such as CHECKSUM), capturing intermediate results in SRAM, and then indirectly reconstructing the Flash image.Note that putting the device into debug/programming mode requires presenting specific commands to the ISSP pins, clocking them in, and reading results. This typically can only be done with direct physical access to the ISSP pins and using specific external hardware and software tools. Affected PSoC� 1 and derivative device documentation will be updated to clarify the capability of ProtectBlock. Applications that do not use the ProtectBlock feature are not affected.
Planned Qualification of Spansion Manufacturing Sites for Cypress ProductsDescription of Change:In concert with the recently announced merger between Cypress Semiconductor Corporation (Cypress) and Spansion Inc. (Spansion), Cypress announces plans to qualify proprietary SONOS Technology products at Spansion Fab 25 / Test 25 in Austin, Texas and BGA/TSOP-packaged products at the Spansion assembly facility in Bangkok, Thailand. These qualifications and implementations are expected to occur throughout 2015 and 2016. Once complete, the qualifications will be announced through regular PCNs.This is an advance notification and no immediate action is needed. Refer to the attached Supplier documentation for the complete schedule of the activity, PCN issue dates and shipment start dates.