Manufacturer Part #
Xplained evaluation Kit for SMART SAM S70 and SAM E70
SAM E70/S70/V70/V71 Family Errata and Data Sheet ClarificationDescription of Change: 1) Updated the Silicon Issue Summary table to be more readable.2) The following Silicon Issues were updated:a) Boundary Scan Mode: Internal Regulator b) XDMAC: TCM Accesses c) FFPI: Flash Programming d) PMC: Wait Mode Exit Fail from Flash e) SDRAMC: SDRAM Controller Scrambling Use Limitation f) SMC: SMC_WPSR Register Write Protection g) TWIHS: I 2C Hold Timing Incompatibility h) TWIHS: Clear Command 3) The following Silicon Issues were added: a) DEVICE: System Performance b) SDRAMC:Operational Voltage Reason for Change: To Improve ProductivityPlease be advised that this is a change to the document only the product has not been changed
Data Sheet - SAM E70/S70/V70/V71 Family Data Sheet Microchip has released a new DeviceDoc for the SAM E70/S70/V70/V71 Family Data Sheet of devices.Description of Change: Updated the following sections or Type:Signal Description Input/Output Lines Memories Peripherals Enhanced Embedded Flash Controller (EEFC) Power Management Controller (PMC) External Bus Interface (EBI) Quad Serial Peripheral Interface (QSPI) Timer Counter (TC) Electrical Characteristics for SAM V70/V71 Electrical Characteristics for SAM E70/S70Reason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 22 Feb 2019NOTE: Please be advised that this is a change to the document only the product has not been changed.
Description of Change:1) The following silicon issues were added:18.2 Programmable Clock Controller22.1 Interpolation Mode2) The following Data Sheet Clarifications were added:Controller Area Network (MCAN)Quad Serial Peripheral Interface (QSPI)Reason for Change: To Improve ProductivityDate Document Changes Effective: 20 Nov 2018
Description of Change:1) General Updates:• PMC - Added missing PCKRDY7, which is missing in the PMC_IER, PMC_IDR and PMC_SR registers.• MCAN - Changed reset value for the MCAN_CREL register.• AFE - Changed CHNB bit field offset in the AFEC_LCDR register.2) Package Drawings:Added the following package mechanical drawings:• LQFP144, 144-lead LQFP, 20x20 mm, pitch 0.5 mm• LFBGA144, 144-ball LFBGA, 10x10 mm, pitch 0.8 mm• TFBGA144, 144-ball TFBGA, 10x10 mm, pitch 0.8 mm• UFBGA144, 144-ball UFBGA, 6x6 mm, pitch 0.4 mm• LQFP100, 100-lead LQFP, 14x14 mm, pitch 0.5 mm• TFBGA100, 100-ball TFBGA, 9x9 mm, pitch 0.8 mm• VFBGA100, 100-ball VFBGA, 7x7 mm, pitch 0.65 mm• LQFP64, 64-lead LQFP, 10x10 mm, pitch 0.5 mm• QFN64, 64-pad QFN 9x9 mm, pitch 0.5 mm, with wettable flanks.Reason for Change: To Improve ManufacturabilityDate Document Changes Effective: 19 Oct 2018NOTE: Please be advised that this is a change to the document only the product has not been changed.
Microchip has released a new DeviceDoc for the SAM E70/S70/V70/V71 Family Data Sheet of devices. Notification Status: FinalDescription of Change:1) Updated from Atmel to Microchip style and template2) Literature number: was changed from the Atmel 44003E to a Microchip DS number3) Data sheet revision letter restarted to "A"4) ISBN number addedImpacts to Data Sheet: NoneReason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 18 Apr 2018NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
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