Manufacturer Part #
Discrete Semiconductor Modules 200 Amps 1400V
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Product Variant Information section
IXYS MCD200-14IO1 - Product Specification
SUBJECT: Assembled Device Marking Format Changes and Outer Box/Bag Label Format Changes - Change to the assembled device marking format The change affects the date code and tracking number identification. This change does not affect the form, fit or function of the product. See attached for more details - Change to the box label format: The paper sticker label found on the outer box or bag will see a format change that incorporates the Littelfuse logo along with the IXYS logo. The printed information remains the same (PN, Qty, Lot #, date code, country of origin). The change allows for a improved readability. This change does not affect the form, fit or function of the product. REMARKS: This changes from the original IXYS Corporation marking/labeling format to the new IXYS LLC-USA format is being done to conform to the SAP product management system requirements of our parent company Littelfuse Corporation.
We want to share with you a brief update on the Littelfuse power semiconductor manufacturing site in Lampertheim, Germany. The site recently experienced an electrical fire that occurred at the power distribution panel on the subfloor of the fab. All employees were safely evacuated, and the site has resumed some operations. The fire did not spread to the manufacturing floor, but this unforeseeable event will cause an interruption to our production. As a result of this incident, despite our urgent recovery actions, you will encounter approximately a 10 week delay to your current delivery schedule for our thyristors rectifier, and fast diodes, as well as any module that includes these components. We sincerely apologize for the inconvenience. Your Littelfuse Customer Service Representative will make the necessary adjustments to your order and also contact you if there are any further changes to this schedule. Please understand that our entire global team is diligently working to resolve this issue as fast as possible to minimize your disruption.
Y4 Bipolar Power Modules Inhouse Backend Assembly Location Transfer REASON OF CHANGE: State-of-the-art power semiconductor assembly capabilities to dramatically improve service levels to customers. Our target is to set this factory as a world class facility with automated, error proof processes to meet the highest quality standards.
As informed already in 2020 and after the successful relocation of our TO-240 product family, I am pleased to announce we are preparing to consolidate and transfer the next power modules back end operations to our new facility located in Lipa city, the Philipines over the coming months. This new Littelfuse facility combines the very best operational excellence and semiconductor expertise to deliver a highly automated, world class facility designed, to meet IATF16949 & VDA6.3 requirements. Our clear focus being to bring high levels of service to our customers and quality products to support future growth of the power semiconductor business. This time, we will consider relocating our Y1 and Y4 power module product families. Standard part numbers for each package are listed in annex. As a valued customer, we are providing this advanced notification to help facilitate a smooth transition of your business to the new facility.