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Manufacturer Part #

1-1542002-1

37.5 mm Heat Sink Assembly For Use with BGA Package

Mfr. Name: TE Connectivity
Standard Pkg:
Product Variant Information section
Date Code:
Product Specification Section
Technical Attributes
Attributes Table
Material: Black Anodized
Dimension: H  9.06mm x D  34.92mm
Features & Applications

The 1-1542002-1 is a Heat Sink Assembly for use with BGA Semiconductor Package.

Product Features:

  • Product Type = Heat Sink
  • Device Type = BGA
  • For Use With = BGA Semiconductor Packages
  • Finish = Black Anodize
  • Material = Aluminum
  • Heat Sink Type = 2 Fin Radial
  • Package Size (mm [in]) = 37.5 [1.478]
  • Height (mm [in]) = 9.06 [0.357]
  • UL Flammability Rating = UL 94V-0
  • Diameter (mm [in]) = 34.92 [1.375]
Pricing Section
Stock:
0
Minimum Order:
250
Multiple Of:
25
On Order:
0
Factory Stock:Factory Stock:
0
Factory Lead Time:
N/A
Total
$5,790.00
USD
Quantity
Web Price
25+
$23.16
Product Variant Information section