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Référence fabricant
530102B00150G
TO-218 Package 6.30 C/W Thermal Resistance High Rise Heat Sink with Fins
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| Nom du fabricant: | Boyd | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :100 par Tray | ||||||||||
| Code de date: | 2404 | ||||||||||
Boyd 530102B00150G - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=530102B00150G&field4=Boyd&field18=https://p1na.futureelectronics.com/fr/p/electromechanical--thermal-management--heatsinks-accessories/530102b00150g-boyd-2789444
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=530102B00150G&field4=Boyd&field18=https://p1na.futureelectronics.com/fr/p/electromechanical--thermal-management--heatsinks-accessories/530102b00150g-boyd-2789444
Boyd 530102B00150G - Caractéristiques techniques
| Thermal Resistance: | 6.3°C/W |
| Material: | Black Anodized |
| Dimension: | H 44.45mm x L 12.45mm x W 44.45mm |
Fonctionnalités et applications
The 530102B00150G High rise style heat sink features twisted fins and solderable Wave On mounts and device clip.
This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component.
Specifications:
- Shape: Square
- Length: 1.750" (44.45 mm)
- Width: 0.490" (12.44 mm)
- Height Off Base (Height of Fin): 1.750" (44.45 mm)
- Material:Aluminum
- Material Finish Black Anodized
- Power Dissipation @ Temperature Rise: 4 W @ 30°C
- Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 400 LFM
- Thermal Resistance @ Natural: 6.3°C/W
View the complete family of High Rise Heat Sinks
Emballages disponibles
Qté d'emballage(s) :
100 par Tray