Product Variant Information section
Available Packages
Package Qty:
1,200
Mounting Method:
Surface Mount
Product Specification Section
Pricing Section
Minimum Order: 1
Multiple Of: 1
| Quantity | Web Price |
|---|---|
| 1 | $0.875 |
| 100 | $0.73 |
| 250 | $0.705 |
| 500 | $0.685 |
| 1,000+ | $0.67 |
Attributes
Attributes Table
| Thermal Resistance | 5°C/W |
| Material | Aluminum / Black Anodized |
| Dimension | H 6.4mm x L 27.9mm x W 27.9mm |
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Features and Applications
The 658-25AB is a part of 658 series Omnidirectional pin fin heat sink for BGAs and PowerPC™, all of the heat sinks are available with any of the following thermal tape and interface materials, pre-applied at the factory. Use the “T” series, thermally enhanced, pressure sensitive adhesives to attach the heat sink to the electronic package and provide a good thermal link to the heat sink. The “S” series interface materials have adhesives on only one side, for pre-attachment to the heat sink, and provide superior thermal performance.
Note:
- None of theses materials are for use in applciations requireing electrical isolation form electronic devices. All options other than -T1 and -T4 are RoHS Compliant
- To obtain the estimated thermal resistance of the interface material in your application, divide the thermal impedance value by the area of the pad in square inches. For example, a 2” x 2” piece of T4 has a resistance of 1.10 C-in^2/W divide by 4 in^2=0.275 C/W