
Manufacturer Part #
658-25AB
658 Series 27.9 x 27.9 x 6.4 mm 5° C/W Resistance Omnidirectional Heat Sink
Product Specification Section
Product Specification
Shipping Information:
Item cannot ship to certain countries. See List
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ECCN:
EAR99
PCN Information:
N/A
File
Date
Part Status:
Active
Active
Technical Attributes
Attributes Table
Thermal Resistance: | 5°C/W |
Material: | Aluminum / Black Anodized |
Dimension: | H 6.4mm x L 27.9mm x W 27.9mm |
Mounting Method: | Surface Mount |
Features & Applications
The 658-25AB is a part of 658 series Omnidirectional pin fin heat sink for BGAs and PowerPC™, all of the heat sinks are available with any of the following thermal tape and interface materials, pre-applied at the factory. Use the “T” series, thermally enhanced, pressure sensitive adhesives to attach the heat sink to the electronic package and provide a good thermal link to the heat sink. The “S” series interface materials have adhesives on only one side, for pre-attachment to the heat sink, and provide superior thermal performance.
Note:
- None of theses materials are for use in applciations requireing electrical isolation form electronic devices. All options other than -T1 and -T4 are RoHS Compliant
- To obtain the estimated thermal resistance of the interface material in your application, divide the thermal impedance value by the area of the pad in square inches. For example, a 2” x 2” piece of T4 has a resistance of 1.10 C-in^2/W divide by 4 in^2=0.275 C/W
Pricing Section
Global Stock:
395
USA:
395
On Order:
0
Factory Lead Time:
N/A
Quantity
Web Price
1
$0.76
50
$0.735
125
$0.725
300
$0.72
750+
$0.715
Product Variant Information section
Available Packaging
Package Qty:
1200 per Box
Mounting Method:
Surface Mount