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Product Variant Information section
Product Specification Section
Pricing Section

Stock: 950

On Order: 0
Factory Stock:Factory Stock: 0
Factory Lead Time: N/A
Minimum Order: 1
Multiple Of: 1
Quantity Web Price
1 $0.95
50 $0.835
125 $0.81
300 $0.785
750+ $0.76
Total:

$0.95

USD
Attributes
Attributes Table
Thermal Resistance 5°C/W
Material Aluminum / Black Anodized
Dimension H  6.4mm x L  27.9mm x W  27.9mm
Features and Applications

The 658-25AB is a part of 658 series Omnidirectional pin fin heat sink for BGAs and PowerPC™, all of the heat sinks are available with any of the following thermal tape and interface materials, pre-applied at the factory. Use the “T” series, thermally enhanced, pressure sensitive adhesives to attach the heat sink to the electronic package and provide a good thermal link to the heat sink. The “S” series interface materials have adhesives on only one side, for pre-attachment to the heat sink, and provide superior thermal performance.

Note:

  • None of theses materials are for use in applciations requireing electrical isolation form electronic devices. All options other than -T1 and -T4 are RoHS Compliant
  • To obtain the estimated thermal resistance of the interface material in your application, divide the thermal impedance value by the area of the pad in square inches. For example, a 2” x 2” piece of T4 has a resistance of 1.10 C-in^2/W divide by 4 in^2=0.275 C/W