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Manufacturer Part #

HSB11-252518

HEAT SINK, BGA, 25 X 25 X 18 MM

ECAD Model:
Mfr. Name: CUI Devices
Standard Pkg:
Product Variant Information section
Date Code:
Product Specification Section
Pricing Section
Global Stock:
0
Germany (Online Only):
0
On Order:
0
Factory Stock:Factory Stock:
0
Factory Lead Time:
16 Weeks
Minimum Order:
1408
Multiple Of:
88
Total
$1,302.40
USD
Quantity
Web Price
88
$1.03
264
$0.985
440
$0.965
1,320
$0.925
2,200+
$0.895
Product Variant Information section