Manufacturer Part #
TX Series Thermal Link Retainers Without BeO Insulator
Features & Applications
They provide an effective retainer and efficient thermal path between semiconductor and heat sinks or chassis. There is excellent transistor retention under high vibration and shock loads. The thermal links can be inserted and removed multiple times without loss of retention or damage to the finish over the entire JEDEC case diameter range. They can be installed with a rivet or eyelet, soldered to a PC pad or heat sink, mounted with a single screw or with a threaded stud and hex nut.
- 1/8” stainless steel socket head cap rod with beryllium copper spring
- IZIF is a highly reliable patentpending design for rugged military and aerospace circuit card applications
- It improved structural integrity and thermal efficiency (.8°C-in./W)
- It comes in mounting method of 4-40 Screw