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Manufacturer Part #
DSC1001CL1-001.8432
DSC1001: Low Power Precision CMOS Oscillator, -40°C to 105°C, 50ppm
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:110 per Tube | ||||||||||
| Date Code: | |||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of STAR as an additional assembly site for selected Micrel products available in 4L VDFN (3.2x 2.5 x 0.9 mm) and (2.0 x2.5 x0.9 mm) packages.Pre Change:Assembled at NSEB assembly sitePost Change:Assembled at NSEB or STAR assembly siteReason for Change:To improve manufacturability and on-time delivery performance by qualifying STARS as an additional assembly site. Estimated Qualification Completion Date: July 2021
Pre Change: With top mark DCPYYWW at the 2nd line marking. Post Change:With top mark DCPYYWW or DAPYYW at the 2nd line marking.Reason for Change: To improve manufacturability and traceability by implementing top marking changes for DSCxxx and DSAxxx products available in 6L VDFN, 4L VDFN, 4L VFLGA, 6L VFLGA, 4L VLGA, 14L VQFN and 20L VQFN packages.Change Implementation Status:In ProgressEstimated First Ship Date: November 19, 2020 (date code: 2047)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
CCB 3960.001 and 3960.002 Final Notice:Revision History:January 07, 2020: Issued initial notification.January 17, 2020: Reissued initial notification to remove BQM information. The BQM will not be changing.June 01, 2020: Reissued initial notification to update the qualification plan. This is a grade 2 qualification.June 18. 2020: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on July 18, 2020.Description of Change:Qualification of new bill of materials (BOM) for selected Micrel products available in 4L VDFN (3.2 x 2.5 x 0.9 mm) and 4L VDFN (2.5 x 2.0 x 0.9 mm) packages at NSEB assembly site.Pre Change:Assembled at NSEB using NEX-130CT die attach material # 1, 8200T die attach material # 2, G770HCD molding compound and Q3-6646 die coat.Post Change:Assembled at NSEB using HR-5104 die attach material # 1, 2200D die attach material # 2, G700LTD molding compound, and JCR6109 die coat.Reason for Change:To improve manufacturability by qualifying new die attach material, molding compound and die coat.Estimated First Ship Date:July 18, 2020 (date code: 2029)
Revision History:January 07, 2020: Issued initial notification.January 17, 2020: Reissued initial notification to remove BQM information. The BQM will not be changing.June 01, 2020: Reissued initial notification to update the qualification plan. This is a grade 2 qualification.Description of Change:Qualification of new bill of materials (BOM) for selected Micrel products available in 4L VDFN (3.2 x 2.5 x 0.9 mm) and 4L VDFN (2.5 x 2.0 x 0.9 mm) packages at NSEB assembly site.Pre Change:Assembled at NSEB using A194 lead frame material, NEX-130CT die 1 attach material, 8200T die 2 attach material, G770HCD molding compound and Q3-6646 die coat.Post Change:Assembled at NSEB using A194 lead frame material, HR-5104 die 1 attach material, 2200D die 2 attach material, G700LTD molding compound, and JCR6109 die coat.Reason for Change:To improve manufacturability by qualifying new die attach material, molding compound and die coat.Estimated Qualification Completion Date:March 2020
Notification subject: CCB 3433 Final Notice: Qualification of a new fabrication site (Microchip -Fab 5) for selected DSCxxx and DSAxxx product available in 6L VDFN, 4L VDFN, 4L VFLGA, 6L VFLGA, 4L VLGA, 14L VQFN and 20L VQFN packages.PCN Status: Final notification.PCN Type: Manufacturing ChangeDescription of Change: Qualification of a new fabrication site (Microchip -Fab 5) for selected DSCxxx and DSAxxx product available in 6L VDFN, 4L VDFN, 4L VFLGA, 6L VFLGA, 4L VLGA, 14L VQFN and 20L VQFN packages.Pre Change: Die # 2 Fabricated at Silex Microsystems sitePost Change: Die # 2 Fabricated at Microchip Technology Colorado - Fab 5 site.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Colorado - Fab 5 site.Change Implementation Status: In ProgressEstimated First Ship Date: April 17, 2020 (date code: 2016)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Revision History:February 24, 2020: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on April 17, 2020.February 26, 2020: Re-issued final notification. Updated the plant code for die #1 at Taiwan Semiconductor Manufacturing Corp. - Fab 3 from TSMC to TC03 and updated the quality certification for die # 1 at Taiwan Semiconductor Manufacturing Corp. Fab-3.Description of Change:Qualification of a new fabrication site (Microchip -Fab 5) for selected DSCxxx and DSAxxx product available in 6L VDFN, 4L VDFN, 4L VFLGA, 6L VFLGA, 4L VLGA, 14L VQFN and 20L VQFN packages.Pre Change:Die # 2 Fabricated at Silex Microsystems site.Post Change:Die # 2 Fabricated at Microchip Technology Colorado - Fab 5 site.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Colorado - Fab 5 site.Estimated First Ship Date:April 17, 2020 (date code: 2016)
CCB 3960.001 and 3960.002 Initial Notice: Qualification of new bill of materials (BOM) for selected Micrel products available in 4L VDFN (3.2 x 2.5 x 0.9 mm) and 4L VDFN (2.5 x 2.0 x 0.9 mm) packages at NSEB assembly site.PCN Status: Initial notification.PCN Type: Manufacturing ChangeDescription of Change: Qualification of new bill of materials (BOM) for selected Micrel products available in 4L VDFN (3.2 x 2.5 x 0.9 mm) and 4L VDFN (2.5 x 2.0 x 0.9 mm) packages at NSEB assembly site.Pre Change: Assembled at NSEB using A194 lead frame material, NEX-130CT die 1 attach material, 8200T die 2 attach material, G770HCD molding compound and Q3-6646 die coat.Post Change: Assembled at NSEB using A194 lead frame material, HR-5104 die 1 attach material, 2200D die 2 attach material, G700LTD molding compound, and JCR6109 die coatImpacts to Data Sheet: None.Change Impact: None.Reason for Change: To improve manufacturability by qualifying new die attach material, molding compound and die coat.Change Implementation Status: In ProgressEstimated Qualification Completion Date: March 2020Impacts to Data Sheet: None.Change Impact: None.Reason for Change: To improve manufacturability by qualifying new die attach material, molding compound and die coat.Change Implementation Status: In ProgressEstimated Qualification Completion Date: March 2020
Description of Change:Qualification of new bill of materials (BOM) for selected Micrel products available in 4L VDFN (3.2 x 2.5 x 0.9 mm) and 4L VDFN (2.5 x 2.0 x 0.9 mm) packages at NSEB assembly site.Pre Change: Assembled at NSEB using A194 lead frame material, NEX-130CT die 1 attach material, 8200T die 2 attach material, G770HCD molding compound, Q3-6646 die coat, and a base quantity multiple of 72.Post Change: Assembled at NSEB using A194 lead frame material, HR-5104 die 1 attach material, 2200D die 2 attach material, G700LTD molding compound, JCR6109 die coat, and a base quantity multiple of 110 and 140.
Part Status:
Available Packaging
Package Qty:
110 per Tube