text.skipToContent text.skipToNavigation
Product Specification Section
Pricing Section

Stock: 4,310

On Order: 0
Factory Stock:Factory Stock: 19,500
Factory Lead Time: 5-10 Days
Minimum Order: 1
Multiple Of: 1
Quantity Web Price
1 $0.815
100 $0.575
250 $0.545
500 $0.52
750+ $0.51
Total:

$1.63

USD
Attributes
Attributes Table
Flat Flex Type FFC, FPC
No of Positions 4
Pitch 1 mm
Style/Orientation Receptacle
Termination Solder
Current Rating 1A
Contact Plating Tin
Material LCP
Contact Material Phosphor Bronze
Operating Temp Range -40°C to +85°C
Features and Applications

The 84952-4 is a part of Wire to Board connectors with low profile and light-weight features having reduced size, weight and assembly cost.

This is widely used in computer industry, particularly in such applications as Lap Top, Notebook, Palm Top and Note Pad Computers. Other markets include: Disk Drives, Printers, Plotters, Copiers, Cellular Phones, and Medical Equipment. Operating temprature ranges from -40°C – +85°C

Product Features:

  • 4 Positions
  • Matte Tin Contact Plating, Mating Area, Material
  • Contact Plating, Mating Area, Thickness = 2 µm
  • Liquid Crystal Polymer (LCP) Housing Material
  • Contact Current Rating, Max (A) = 1
  • Operating Voltage (VAC) = 200
  • Selectively Loaded = No
  • PCB Mount Retention Type = Solder Pads
  • Profile Height (Y-Axis) = 2.56 mm
  • Contact Plating, Mating Area, Material = Matte Tin
  • Housing Material = Liquid Crystal Polymer (LCP)
  • Contact Mating Location = Bottom
  • Lead Free Solder Processes = Reflow solder capable to 245°C, Reflow solder capable to 260°C
  • Contact Design = Single Beam