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Manufacturer Part #

DILB28P-223TLF

28 Position (2 x 14 ) 2.54 mm Pitch Open Frame Through Hole DIP Socket

ECAD Model:
Mfr. Name: Amphenol Communications Solutions
Standard Pkg:
Product Variant Information section
Date Code:
Product Specification Section
Amphenol Communications Solutions DILB28P-223TLF - Technical Attributes
Attributes Table
Type: DIP Socket
Style: PCB Through Hole
No of Pins: 28
Termination Style/Mounting: Solder
Terminal Pitch: 2.54mm
Contact Material: Copper Alloy
Contact Plating: Tin
Rated Current: 1A
Material: Polyamide
Insulation Resistance: 1000MΩ
Operating Temp Range: -55°C to +105°C
No of Rows: 2
Dielectric Withstanding Voltage: 1000V
Mounting Method: Through Hole
Pricing Section
Global Stock:
0
USA:
0
On Order:
0
Factory Stock:Factory Stock:
0
Factory Lead Time:
9 Weeks
Minimum Order:
9180
Multiple Of:
17
Total
$4,131.00
USD
Quantity
Web Price
1
$0.545
75
$0.525
250
$0.505
750
$0.49
2,500+
$0.45
Product Variant Information section