
Manufacturer Part #
1932768-1
SUPER LOW PROFILE 1.95SIM WITH FLANGE
TE Connectivity 1932768-1 - Product Specification
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General Product Description:Simcard, GPL K86:2199337-5, 2174803-2 , 2229333-2 , 2822541-1, 1981959-1, 2309923-2, 1932768-1, 2309923-1Description of ChangesDue to business increase, QD plant need new production line enter and plant space is limited, to support customer demand well, we plan outsourcing some projects. Estimated transfer schedule will be on the end of Aug.Reason for Changes:For Simcard project, only Assy line location changed to supplier which near QD plant, other process all keep as before. The new manufacturing location is under a certified quality management system according the standard industry requirements. An internal release based on specifications will executed before any parts will be delivered which guarantees the performance.First Ship Date of Changed Items (Changed Parts Only):31-AUG-2022
I want to make you aware that on November 26th we announced the closure of TE Connectivity Data & Devices Shanghai East manufacturing facility with targeted completion by May 2020. This decision is the result of our ongoing footprint evaluation and the need to streamline operating efficiencies and align manufacturing resources. During this transition our commitment to you remains unchanged. The impacted operations currently taking place in Shanghai East manufacturing facility will be transferred to other Data & Devices manufacturing facilities in China. We are focused on meeting our commitments to scheduled shipments and mitigating any possible disruption to you.
Description of Changes Correction to PCNs P-19-018353 & P-19-018356 for part numbers listed. Reason for Changes: As previously notified in PCNs P-19-018353 & P-19-018356, TE has announced the closure of the Data & Devices Shanghai East manufacturing facility. The PNs listed below were originally planned to move from TE Shanghai to TE Guangdong, however, the PNs listed below will now be transferred from TE Shanghai to TE Qingdao.
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