Manufacturer Part #
24LC02 Series 2 Kb I2C 2 Wire (256 x 8) 2.5 V Serial EEPROM SMT - SOIC-8
|Standard Pkg:|| |
Product Variant Information section
3300 per Reel
Description of Change: 1) Corrected Part Marking for UDFN package. 2) . Added note about exposed pad on the TDFN and UDFN packages.Reason for Change: To Improve ManufacturabilityDate Document Changes Effective: 09 May 2019NOTE: Please be advised that this is a change to the document only the product has not been changed.
Memo # ML122018001Q: Final Notice: Qualification of 36.3K process technology for selected Microchip products of the 24xx01, 24xx02, and 24xx04 device families.PCN Status: Final notification. PCN Type: Manufacturing ChangeDescription of Change: Qualification of 36.3K process technology for selected Microchip products of the 24xx01, 24xx02, and 24xx04 device families.Pre Change: Available in 160K wafer technology fabricated at Microchip fabrication sites FAB2 and FAB4 (Tempe, AZ and Gresham, OR, USA) using 8 inch wafers Post Change: Available in 160K wafer technology fabricated at Microchip fabrication sites FAB2 and FAB4 (Tempe, AZ and Gresham, OR, USA) using 8 inch wafers or available in 36.3K wafer technology fabricated at FAB 5 (Colorado Springs, CO, USA) using 6 inch wafers.Impacts to Data Sheet: NoneChange Impact: None Reason for Change: To improve manufacturability by qualifying an additional fabrication site.Change Implementation Status: In Progress.Estimated First Ship Date: February 5, 2019 (date code: 1906)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
PCN Status: Final notificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 40K, 42K, 77K, 120K, 150K, 160K and 200K wafer technologies available in 8L SOIC package at MMT assembly site.Pre Change: Gold (Au) or Palladium coated copper wire (PdCu) bond wirePost Change:Palladium coated copper with gold flash (CuPdAu) bond wire
|Memory Organization:||256 x 8|
|Supply Voltage-Nom:||2.5V to 5.5V|
|Write Cycle Time-Max (tWC):||5ms|
|Mounting Method:||Surface Mount|
Features & Applications
The 24XX02 also has a page write capability for up to 8 bytes of data. The 24XX02 is available in the standard 8-pin PDIP, surface mount SOIC, TSSOP, 2x3 DFN and MSOP packages and is also available in the 5-lead SOT-23 package.
- Single supply with operation down to 2.5 V for 24LC02B devices
- Low-power CMOS technology
- 2-wire serial interface, I2C™ compatible
- Schmitt Trigger inputs for noise suppression
- Output slope control to eliminate ground bounce
- 100 kHz and 400 kHz clock compatibility
- Page write time 3 ms, typical
- More than 1 million erase/write cycles
- Data retention >200 years
3300 per Reel