Manufacturer Part #
FM22L16 Series 4 Mb (256 K x 16) 3 V 55 ns Parallel F-RAM Memory - TSOP-44
|Standard Pkg:|| |
Product Variant Information section
1000 per Reel
Subject: Planned Qualification of New Assembly, Test, and Finish Sites for Select RAM ProductsDescription of Change: Cypress is planning to qualify new sources of supply for select RAM products currently running at JCET (78 Changshan Rd, Jiangyin, Jiangsu, China 214400) and OSET (12-2 Nel Huan South Rd. N.E.P.Z. Kaohsiung, Taiwan 811, R.O.C.). The products will be qualified at the following sites already utilized by Cypress for similar packages: a. Greatek Taiwan for Assembly, Test, and Finish (No.136, Gon-Yi Rd. Zhunan Township, Miaoli County 350 Taiwan, R.O.C.) b. UTAC Thailand for Assembly, Test, and Finish (237 Lasalle Road, Sukhumvit 105 Bangna, Bangkok 10260 Thailand) c. Unimos China for Assembly (9688 Songze Ave., Qingpu Industrial Zone, Shanghai, China) d. KYEC Taiwan for Test and Finish (No. 81, Sec.2, Gongdaowu Rd., Hsin-Chu 300, Taiwan, R.O.C.) e. Cypress Philippines for Assembly, Test, and Finish (Gateway Business Park, SEPZA, Brgy., Javalera, General Trias, Cavite, Philippines) f. Cypress Bangkok for Assembly, Test, and Finish (229 Moo 4 Changwattana Road, Bangkok, Thailand) These sites are qualified to build standard and automotive grade products consistent with AEC-Q100/AEC-Q006 standards. Benefit of Change: Cypress will have the capability to meet market demand, and to ensure consistent and reliable delivery performance to customers. It is important, especially in the current pandemic situation, to establish alternate sources of supply. Qualification Status: Estimated dates for completion of the qualifications are provided in this notification. Document No. 001-53348 Rev.*H Page 3 of 3 Approximate Implementation Date: Estimated implementation dates are provided in this notification. Given the criticality of establishing alternate sources of supply, it is important that we enable these sources expeditiously. Anticipated Impact: No impact to form, fit and function is expected.
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
Description of Change: Cypress has qualified an EIA standard outline cover tape for all tape and reel shipment at Cypress Philippines (CML, Gateway Business Park, SEPZA, Brgy., Javalera, General Trias, Cavite, Philippines). The new cover tape meets the Cypress specification and demonstrates the same quality as the current cover tape.
Qualification of OSE-T as an Additional Assembly Site for Select Pb-Free ProductsDescription of Change: Cypress announces the qualification of Orient Semiconductor Electronics, Taiwan (OSE-T) as an additional assembly site for select commercial and industrial grade products. These products are RoHS and REACH compliant. Benefit of Change: Qualification of alternate manufacturing sites is part of the ongoing flexible manufacturing initiative announced by Cypress. The goal of the flexible manufacturing initiative is to provide the means for Cypress to continue to meet delivery commitments through dynamic, changing market conditions. Approximate Implementation Date: Effective 90 days from the date of this notification or upon customer approval, whichever comes first, all shipments of Commercial and Industrial non-PPAP part numbers in the attached file will be assembled at OSE-T or other approved assembly sites. Anticipated Impact: Products assembled at the new site are completely compatible with existing products from form, fit, functional, parametric and quality performance perspectives. Cypress also recommends that customers take this opportunity to review these changes against current application notes, system design considerations and customer environment conditions to assess impact (if any) to their application.
Qualification of Texas Instruments' DMOS6 as an Additional Wafer Fab Site, Test 25 as an Additional Wafer Sort Site, OSE-Taiwan as an Additional Assembly Site for 44-TSOP II Package with Copper Wire for the 4Mb Parallel Industrial-Grade Product Family Cypress announces the qualification of TI's DMOS6 as an additional wafer fab site and Test 25 as an additional wafer sort site for 4Mb Parallel industrial-grade F-RAM product family. Cypress also announces the qualification of Orient Semiconductor Electronics (OSE-T), Taiwan as an additional assembly site for the 44-TSOP II package with Copper wire bonds for select 4Mb parallel industrial-grade F-RAM products. The 48-BGA package will continue to be manufactured at ASE-KH. Qualification of alternate manufacturing sites is part of the ongoing flexible manufacturing initiative announced by Cypress. The goal of the flexible manufacturing initiative is to provide the means for Cypress to continue to meet delivery commitments through dynamic, changing market conditions. All of these changes must be qualified simultaneously in order to ensure continuity of supply given the tight capacity situation. DMOS6, Test 25 and Cu/CuPd/CuPdAu wires are already being used to fabricate, sort and assemble other F-RAM products in densities ranging from 4Kb to 2Mb. Effective 90 days from the date of this notification or upon customer approval, whichever comes first, all shipments of the affected part numbers in the attached file will be supplied from DMOS6 or other approved wafer fabrication sites and will be sorted at Test 25 or other approved wafer sort sites. The 44-TSOP II parts will be built at OSE-Taiwan and will transition to CuPdAu wire. Products fabricated at DMOS6, sorted at Test 25, assembled at OSE-Taiwan and with CuPdAu wires are completely compatible with the existing product from form, fit, functional, parametric and quality performance perspectives.
|FRAM Type:||Non Volatile|
|Memory Organization:||256 K x 16|
|Supply Voltage-Nom:||2.7V to 3.6V|
|Temperature Range:||-40°C to +85°C|
|Number of Words:||256 K|
|Storage Temperature Range:||-55°C to +125°C|
|No of Terminals:||44|
|Moisture Sensitivity Level:||3|
|Package Style:||TSOP II-44|
|Mounting Method:||Surface Mount|
1000 per Reel