
Manufacturer Part #
MCP6V06T-E/MNY
MCP6V06 Series 5.5 V 1.3 MHz 300 uA Auto-Zeroed Operational Amplifier - TDFN-8
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Mfr. Name: | Microchip | ||||||||||
Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Reel Package Style:TDFN-8 Mounting Method:Surface Mount | ||||||||||
Date Code: |
Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:February 12, 2018: Issued initial notification.June 26, 2018: Issued final notification. Attached the Qualification Report. Revised the affected parts list. Provided estimated first ship date on July 26, 2018.Description of Change:Qualification of 8600 die attach and G700LTD mold compound for selected products available in 8L TDFN package at NSEB assembly site.Pre Change: Using 8200T die attach material and G770HCD molding compound material.Post Change: Using 8200T or 8600 die attach material and G770HCD or G700LTD molding compound material.Reason for Change:To improve manufacturability by qualifying G770HCD mold compound and 8600 die attach material.Estimated First Ship Date:July 26, 2018 (date code: 1830)
Description of Change:Qualification of 8600 die attach and G700LTD mold compound for selected products available in 8L TDFN package at NSEB assembly site. Pre Change: Using 8200T die attach material and G770HCD molding compound materialPost Change: Using 8200T or 8600 die attach material and G770HCD or G700LTD molding compound materialReason for Change:To improve manufacturability by qualifying G700LTD mold compound and 8600 die attach material.Estimated Qualification Completion Date:May 2018
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
Product Lifecycle:
Technical Attributes
No of Channels: | 1 |
Slew Rate-Nom: | 0.5V/µs |
Input Offset Voltage-Max: | 3µV |
Package Style: | TDFN-8 |
Mounting Method: | Surface Mount |
Features & Applications
Microchip Technology Inc. is a leading provider of microcontroller and analog semiconductors, providing low-risk product development, lower total system cost and faster time to market for thousands of diverse customer applications worldwide. Microchip offers a broad spectrum of analog products with a focus on power management, thermal management, linear and mixed-signal solutions.
The Microchip Technology Inc. MCP6V06/7/8 family of operational amplifiers has input offset voltage correction for very low offset and offset drift. These devices have a wide gain bandwidth product (1.3 MHz, typical) and strongly reject switching noise. They are unity gain stable, have no 1/f noise, and have good PSRR and CMRR. These products operate with a single supply voltage as low as 1.8V, while drawing 300 μA/amplifier (typical) of quiescent current. The Microchip Technology Inc. MCP6V06/7/8 op amps are offered in single (MCP6V06), single with Chip Select (CS) (MCP6V08), and dual (MCP6V07). They are designed in an advanced CMOS process.
Features
- High DC Precision
- VOS Drift: ±50 nV/°C (maximum)
- VOS: ±3 μV (maximum)
- AOL: 125 dB (minimum)
- PSRR: 125 dB (minimum)
- CMRR: 120 dB (minimum)
- Eni: 1.7 μVP-P (typical), f = 0.1 Hz to 10 Hz
- Eni: 0.54 μVp-p (typical), f = 0.01 Hz to 1 Hz - Low Power and Supply Voltages
- IQ: 300 μA/amplifier (typical)
- Wide Supply Voltage Range: 1.8V to 5.5V - Easy to Use
- Rail-to-Rail Input/Output
- Gain Bandwidth Product: 1.3 MHz (typical)
- Unity Gain Stable
- Available in Single and Dual
- Single with Chip Select (CS): MCP6V08 - Extended Temperature Range: -40°C to +125°C
Applications
- Portable Instrumentation
- Sensor Conditioning
- Temperature Measurement
- DC Offset Correction
- Medical Instrumentation
The MCP6V06T-E/MNY comes in a TDFN-8 package and is available in a 3300 piece reel.
Available Packaging
Package Qty:
3300 per Reel
Package Style:
TDFN-8
Mounting Method:
Surface Mount