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Manufacturer Part #
TC1412COA713
TC1412 Series 2 A 16 Vmax Single Low Side Inverting MOSFET Driver - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Reel Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Product Specification
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Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 8L and 14L SOIC package at MTAI assembly site.Pre Change: Using Palladium coated copper wire (PdCu) bond wirePost Change: Using palladium coated copper with gold flash (CuPdAu) bond wireReason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Estimated First Ship Date: February 22, 2018 (date code: 1808)
Data Sheet - TC1412/1412N Data Sheet Silicon Die Revision AdditionDescription of Change: 1) Addition of silicon die revision A1. 2) Updated the values for Electrostatic Discharge (ESD) in the Features and General Description columns. 3) Updated the Pin Description table in Section 3.0, Pin Descriptions. 4) Updated package marking information and drawings in Section 5.0, Packaging Information. 5) Minor grammatical and spelling correcttions.Impacts to Data Sheet: Revise the features and description sections on page one ESD protect from 4kV to 2kV.
Product Lifecycle:
Technical Attributes
| Configuration: | Low Side |
| No of Outputs: | Single |
| Output Impedance: | 4Ω |
| Peak Output Current: | 2A |
| Supply Voltage-Max: | 16V |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3300 per Reel
Package Style:
SOIC-8
Mounting Method:
Surface Mount
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