
Manufacturer Part #
LE87286NQC
G.Fast Line Drivers
Microchip LE87286NQC - Product Specification
Shipping Information:
ECCN:
PCN Information:
Microchip has released a new Product Documents for the LE87286 Silicon Errata and Data Sheet Clarification of devices.Notification Status: FinalDescription of Change: 1. Initial ReleaseImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 14 Jun 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Description of Change: Qualification of MMT as an additional assembly site for selected Microsemi products available in 28L VQFN (4x5x1mm) and 16L VQFN (4x4x1mm) packages.Pre Change:Assembled at ASEM using palladium coated copper wire (PdCu) bond wire or palladium coated copper wire with gold flash (CuPdAu) bond wire, CRM1076DS die attach, and CEL-9240HF10AK-G1 mold compound material or assembled at UNIC using palladium coated copper wire (PdCu) bond wire, 8290 die attach, and G770HP mold compound material.Post Change:Assembled at ASEM using palladium coated copper wire (PdCu) bond wire or palladium coated copper wire with gold flash (CuPdAu) bond wire, CRM1076DS die attach, and CEL-9240HF10AK-G1 mold compound material or assembled at UNIC using palladium coated copper wire (PdCu) bond wire, 8290 die attach, and G770HP mold compound material or assembled at MMT using or palladium coated copper wire with gold flash (CuPdAu) bond wire wire material, 3280 dieattach, and G700LTD mold compound material.Reason for Change:To improve productivity and on-time delivery by qualifying MMT as an additional assembly site. Estimated First Ship Date)December 7, 2020 (date code: 2050)
Part Status:
Microchip LE87286NQC - Technical Attributes
No of Outputs: | Single |
Package Style: | QFN-16 |
Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
490 per Tray
Package Style:
QFN-16
Mounting Method:
Surface Mount