Manufacturer Part #
Integrated Protection IC on 12V Bus with PMBUS
|Mfr. Name:||Maxim Integrated|
CHANGE FROM: Current Assembler for products in Flip Chip QFN (FCQFN) package using 1P1M bump process (One layer of Polyimide/Metal).CHANGE TO:Products using 2P2M bump process (Two layers of Polyimide/Metal) will be assembled at UTAC THAI LIMITED / THAILAND (UTL)JUSTIFICATION: The 2P2M bump process change is required improve the quality and reliability of Maxim’s Flip chip QFN package. Maxim has qualified UTL to perform final assembly using the new bump process flow.There are no changes to the form, fit or function of the devices.