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Manufacturer Part #
MIC59300-1.2WU
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50 per Tube
TO-263-5 (D2PAK5)
Surface Mount
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Description of Change:Qualification of KF site as a new BGBM (Backside grinding/metallization) chipbond site for selected HV2815, HV2070, HV2607, HV2707, HV2708, HV2803, HV2818, HV2903, HV2904, HV2915, HV2916, HV2918, HV7322, HV7358, LM2575, LM2576, MIC2171, MIC29150, MIC29151, MIC29152, MIC29201, MIC29202, MIC29203, MIC29204, MIC2920A, MIC29300, MIC29301, MIC29302, MIC29302A, MIC29302H, MIC29303, MIC29310, MIC29312, MIC29371, MIC29372, MIC2937A, MIC2940A, MIC2941A, MIC29500, MIC29501, MIC29502, MIC29503, MIC29510, MIC29512, MIC2954, MIC29712, MIC29751, MIC29752, MIC35302, MIC37100, MIC37102, MIC37150, MIC37151, MIC37152, MIC37252, MIC37300, MIC37301, MIC37302, MIC37501, MIC37502, MIC39100, MIC39101, MIC39150, MIC39151, MIC39152, MIC39300, MIC39301, MIC39302, MIC39500, MIC39501, MIC4574, MIC4575, MIC4576, MIC4685, MIC47150, MIC47300, MIC49150, MIC49200, MIC49300, MIC49500, MIC59300, MIC69301, MIC69302, MIC69502, MIC94050 and MIC94051 device families available in various packages.Reason for Change:To improve manufacturability by qualifying KF site as a new BGBM (Backside grinding/metallization) chipbond site.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.