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Manufacturer Part #
TCN75-5.0MUA713
TCN75 Series 5.5 V Surface Mount Digital Temperature Sensor - MSOP-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:2500 per Reel | ||||||||||
| Date Code: | |||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:November 28, 2017: Issued initial notification.December 22, 2017: Re-issued initial notification to correct the Pre and Post Change summary from CuPdAu wire to Au wire.May 23, 2018: Issued final notification. Attached the Qualification Report. Revised the affected parts list. Provided estimated first ship date on June 23, 2018.July 09, 2018: Resend PCN to update qual report title.Description of Change:Qualification of MMT as an additional assembly site for selected products available in 8L MSOP package using gold (Au) bond wire.Pre Change: Assembled at MTAI assembly site.Post Change: Assembled at MTAI or MMT assembly site.Reason for Change:To improve productivity by qualifying MMT as an additional assembly site.Estimated First Ship Date: June 23, 2018 (date code: 1825)
Description of Change:Qualification of MMT as an additional assembly site for selected products available in 8L MSOP package using gold (Au) bond wire.Pre Change:Assembled at MTAI assembly site.Post Change:Assembled at MTAI or MMT assembly site.Reason for Change:To improve productivity by qualifying MMT as an additional assembly site.Estimated First Ship Date:June 23, 2018 (date code: 1825)
Description of Change:Qualification of MMT as an additional assembly site for selected products available in 8L MSOP package using gold (Au) bond wire.Pre Change:Assembled at MTAI assembly site.Post Change:Assembled at MTAI or MMT assembly site.Reason for Change:To improve productivity by qualifying MMT as an additional assembly site.Estimated Qualification Completion Date:January 2018
Description of Change:Qualification of MMT as an additional assembly site for selected products available in 8L MSOP package using gold (Au) bond wire.Pre Change: Assembled at MTAI assembly site.Post Change:Assembled at MTAI or MMT assembly site.Reason for Change:To improve productivity by qualifying MMT as an additional assembly site.Estimated Qualification Completion Date:January 2018
Description of Change:Qualification of MMT as an additional assembly site for selected products available in 8L MSOP package using gold (Au) bond wire.Pre Change: Assembled at MTAI assembly site.Post Change:Assembled at MTAI or MMT assembly site.Reason for Change:To improve productivity by qualifying MMT as an additional assembly site.Estimated Qualification Completion Date:January 2018
Product Lifecycle:
-
ROHS Compliant -
Lead Free
Technical Attributes
| Output Type: | Digital |
| Supply Voltage: | 2.7V to 5.5V |
| Operating Temp Range: | -55°C to +125°C |
| Interface Type: | 2-Wire / I2C / SMBus |
| Thermal Resistance: | 250°C/W |
| Accuracy: | ±3%RH |
| Storage Temperature Range: | -65°C to +150°C |
Available Packaging
Package Qty:
2500 per Reel
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