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Manufacturer Part #
LE58QL021FJCT
LE58QL021 Series 3.3 V Quad Low Voltage Subscriber Line Audio-Processing-PLCC-44
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:500 per Reel Package Style:PLCC-44 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2104 | ||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:November 06, 2019: Issued initial notification.June 15, 2020: Issued final notification. Attached is the qualification report and added the estimated first date by June 30, 2020.Description of Change:Qualification of MMT as a new assembly site for selected Microsemi LE58QL0xxx device family available in 32L PLCC (11.5x14x3.37mm) and 44L PLCC (16.6x16.6x4.4mm) packages using palladium coated copper with gold flash (CuPdAu) bond wire.Pre Change:Assembled at ASEM assembly site using copper (Cu) bond wire, YIZ8143 die attach and CEL 9240HF10AK-G1 molding compound material.Post Change:Assembled at MMT assembly site using palladium coated copper with gold flash (CuPdAu) bond wire, 3280 die attach and G600V molding compound material.Reason for Change:To improve manufacturability and on-time delivery by qualifying MMT as new assembly site Estimated First Ship Date:June 30, 2020 (date code: 2027)
Initial Notice: Qualification of MMT as a new assembly site for selected MSCC LE58QL0xxx device family available in 32L PLCC (11.5x14x3.37mm) and 44L PLCC (16.6x16.6x4.4mm) packages using palladium coated copper with gold flash (CuPdAu) bond wirePre Change: Assembled at ASEM assembly site using copper (Cu) bond wire, YIZ8143 die attach and CEL 9240HF10AK-G1 molding compound material.Post Change:Assembled at MMT assembly site using palladium coated copper with gold flash (CuPdAu) bond wire, 3280 die attach and G600V molding compound materialReason for Change:To improve manufacturability and on-time delivery by qualifying MMT as new assembly site
CCB 3843 Final Notice: Implement Microchip Packing Changes for selected Microsemi (LCLD, VPT, TIM, WIFI) products. PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change: Implement Microchip Packing Changes for selected Microsemi products within the Microsemi subsidiaries Microsemi Solutions Sdn.Bhd. which includes formerly Voice Line Circuits and Line Drivers (LCLD), WLAN FEM, PA and LNA�s (WiFi), Audio and Voice (VPT) and Timing and Synchronization (TIM) / Zarlink/Maxim.Pre Change: Using Microsemi�s packing process. Post Change: Using Microchip�s packing process.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change: To improve productivity by standardizing the packing method as part of the integration of Microsemi and Microchip.Change Implementation Status: In ProgressEarliest Implementation Date: August 07, 2019Note: The earliest implementation date is the earliest date that we may implement any combination of the changes listed in this PCN as we will not implement any of the proposed changes prior to this date. After the earliest implementation date these changes may occur to any product over the course of many months depending on inventory levels and business conditions.
Information Notification: Integration of the Microsemi LCLD, WIFI, VPT and TIM PCN system with the Microchip PCN System for selected Microsemi LCLD, WIFI, VPT and TIM productsDescription of Change: Integration of the Microsemi LCLD, WIFI, VPT and TIM PCN system with the Microchip PCN System for selected Microsemi LCLD, WIFI, VPT and TIM products within the Microsemi subsidiaries Microsemi Solutions Sdn.Bhd. which includes formerly Voice Line Circuits and Line Drivers (LCLD), WLAN FEM, PA and LNA�s (WiFi), Audio and Voice (VPT) and Timing and Synchronization (TIM) / Zarlink/Maxim. As part of the Microsemi integration with Microchip, Microsemi will integrate from the current Product/Process Change Notification (PCN) and End of Life (EOL) Notification system to the Microchip notification system.Pre Change: Using Microsemi LCLD, WIFI, VPT and TIM PCN systemPost Change: Using Microchip PCN systemReason for Change:To support the Microsemi integration with Microchip by archiving the Microsemi LCLD, WIFI, VPT and TIM PCN system and providing customers with the Microchip PCN service for selected Microsemi LCLD, WIFI, VPT and TIM products.
Description of Change:Implement Microchip top marking changes for selected Microsemi products within the Microsemi subsidiaries Microsemi Solutions Sdn. Bhd. which includes Voice Line Circuits and Line Drivers(LCLD), Audio and Voice (VPT), Timing and Synchronization(TIM) and WLAN FEM, PA and LNA's (WiFi) Business Units.Pre Change:Microsemi top marking format and traceability code.Post Change:Microchip top marking format and traceability code.Reason for Change:To improve manufacturability and traceability by standardizing marking format for selected Microsemi products as part of the integration of Microchip and Microsemi.Earliest Implementation Date:May 1, 2019
Description of Change:Implement Microchip Part Aging, Combination Rules, Recertification Program, and Label Policy for selected Microsemi products within the Microsemi subsidiaries Microsemi Solutions Sdn. Bhd. which includes Voice Line Circuits and Line Drivers (LCLD), Audio and Voice (VPT), Timing and Synchronization (TIM) and WLAN FEM, PA and LNA's (WiFi) Business UnitsChange in Part Aging PolicyChange in Combination RulesChange in ProgramChange in Reel/Bag/Inner/Outer Shipping/MSL LabelsPre Change: Using Microsemi's packing process.Post Change: Using Microchip's packing process.
Part Status:
Technical Attributes
| Package Style: | PLCC-44 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
500 per Reel
Package Style:
PLCC-44
Mounting Method:
Surface Mount