Manufacturer Part #
Subject: USB Products Failure Analysis Policy Change Description of Change: Cypress is changing its policy for failure analysis of USB products to only accept units for failure analysis if the customer has successfully completed an ABA swap test1 for non-WLCSP/BGA packages or chip isolation test for WLCSP/BGA packages to confirm the failure was caused by the Cypress device. Additional information to replicate and solve the customer issue in a timely manner will be required. Benefit of Change: By implementing this policy change, Cypress will better be able to respond to the confirmed issues customers are observing. This policy change is required due to the large percentage of NTF (No Trouble Found) results on USB failure analysis cases. Approximate Implementation Date: This change will be implemented effective with the date of this notification.
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
Qualification of New Bill of Materials for QFN Pb-Free Packages Assembled at Cypress Philippines Description of Change: Cypress announces the qualification of new bill of materials (BOM) for QFN Pb-Free packages assembled at Cypress Philippines (CML, Gateway Business Park, SEPZA, Javalera, Gen. Trias Cavite, Philippines). These changes have been done to simplify the process flow or control resulting in better product quality, field reliability and continuity of supply. This in turn provides the means for Cypress to continue to meet our customers' requirements and meet our delivery commitments in dynamic market conditions. These products are ROHS compliant.
Description of Alert: PSoC� 1 and derivative devices began shipping in 2002, and over time they have been successfully used in a broad spectrum of applications. Unfortunately, it has recently been discovered that a skilled hacker with physical possession of a device and specific hardware and software tools can use the device in a manner not intended, and extract the data stored in Flash in circumvention of the ProtectBlock feature. Cypress is issuing this PIN to notify our customers about the recent event. PSoC� 1 and derivative devices offer external access and control of device resources through a debug/programming mode which uses the In-system Serial Programming Protocol (ISSP). If the designer chooses, it is possible to prevent external read and write access of Flash during this mode by using the ProtectBlock feature. However, the feature does not block access to SRAM memory. As a result, it is possible to circumvent the ProtectBlock feature by conducting system operations on Flash (such as CHECKSUM), capturing intermediate results in SRAM, and then indirectly reconstructing the Flash image.Note that putting the device into debug/programming mode requires presenting specific commands to the ISSP pins, clocking them in, and reading results. This typically can only be done with direct physical access to the ISSP pins and using specific external hardware and software tools. Affected PSoC� 1 and derivative device documentation will be updated to clarify the capability of ProtectBlock. Applications that do not use the ProtectBlock feature are not affected.