Manufacturer Part #
USB 2.7 V 48 MHz 128 KB Flash surface Mount Type-C Dual Port Controller - BGA-96
|Standard Pkg:|| |
Product Variant Information section
490 per Tray
Subject: USB Products Failure Analysis Policy Change Description of Change: Cypress is changing its policy for failure analysis of USB products to only accept units for failure analysis if the customer has successfully completed an ABA swap test1 for non-WLCSP/BGA packages or chip isolation test for WLCSP/BGA packages to confirm the failure was caused by the Cypress device. Additional information to replicate and solve the customer issue in a timely manner will be required. Benefit of Change: By implementing this policy change, Cypress will better be able to respond to the confirmed issues customers are observing. This policy change is required due to the large percentage of NTF (No Trouble Found) results on USB failure analysis cases. Approximate Implementation Date: This change will be implemented effective with the date of this notification.
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
Qualification of JEDEC Shipping Tray for 96 Ball VFBGA 6.0x6.0x1.0 mm Package Description of Change: Cypress has qualified a JEDEC standard outline shipping tray for the 96 Ball VFBGA 6.0x6.0x1.0 mm package. The change increases the pocket density of the tray and minimum order quantity (MOQ). The current JEDEC standard shipping tray with a 13 x 33 device matrix (429 units) will be replaced by a JEDEC shipping tray with a 14 x 35 device matrix (490 units). No changes were made to the following attributes: Tray Length and Width Tray Stacking height Unit orientation in tray pocket Temperature Rating Color JEDEC compliance Benefit of Change: This change is part of Cypress cost saving initiative. It will accommodate more units per tray for shipping to customers and reduce indirect material cost. Approximate Implementation Date: This change will be implemented 90 days from the date of this notification. Anticipated Impact: The change involved tray critical dimensions which will impact the pick and place equipment. Cypress recommends that customers review these changes against their current pick and place programs and equipment parameters.
|Supply Voltage-Nom:||2.7V to 5.5V|
|No of Functions / Channels:||1|
|Operating Temp Range:||-40°C to +85°C|
|No of Terminals:||96|
|Moisture Sensitivity Level:||3|
|Mounting Method:||Surface Mount|
490 per Tray