Manufacturer Part #
FUO50-16N
FUO50 Series 1600 Vrrm 50 A 1.3 Vf Three Phase Rectifier Bridge - ISOPLUS-I4
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| Mfr. Name: | IXYS | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:25 per Tube Package Style:ISOPLUS-I4-PAK Mounting Method:Through Hole | ||||||||||
| Date Code: | |||||||||||
IXYS FUO50-16N - Product Specification
Shipping Information:
ECCN:
PCN Information:
SUBJECT: Assembled Device Marking Format Changes and Outer Box/Bag Label Format Changes - Change to the assembled device marking format The change affects the date code and tracking number identification. This change does not affect the form, fit or function of the product. See attached for more details - Change to the box label format: The paper sticker label found on the outer box or bag will see a format change that incorporates the Littelfuse logo along with the IXYS logo. The printed information remains the same (PN, Qty, Lot #, date code, country of origin). The change allows for a improved readability. This change does not affect the form, fit or function of the product. REMARKS: This changes from the original IXYS Corporation marking/labeling format to the new IXYS LLC-USA format is being done to conform to the SAP product management system requirements of our parent company Littelfuse Corporation.
We want to share with you a brief update on the Littelfuse power semiconductor manufacturing site in Lampertheim, Germany. The site recently experienced an electrical fire that occurred at the power distribution panel on the subfloor of the fab. All employees were safely evacuated, and the site has resumed some operations. The fire did not spread to the manufacturing floor, but this unforeseeable event will cause an interruption to our production. As a result of this incident, despite our urgent recovery actions, you will encounter approximately a 10 week delay to your current delivery schedule for our thyristors rectifier, and fast diodes, as well as any module that includes these components. We sincerely apologize for the inconvenience. Your Littelfuse Customer Service Representative will make the necessary adjustments to your order and also contact you if there are any further changes to this schedule. Please understand that our entire global team is diligently working to resolve this issue as fast as possible to minimize your disruption.
Littelfuse would like to notify you that we will transfer our backend assembly process of Thyristor/Diode products I4Pac & GUFP Package to our new inhouse assembly factory in Lipa, Philippines. This brand-new assembly factory is to fulfill our strategy to invest in state-of-the-art power semiconductor assembly capabilities to dramatically improve our service levels to customers. Our target is to build this factory as a world class facility with automated, error proof processes to meet the highest quality standards. Contact our local Sales team in case you would like to understand more about this new factory. Below is the detail changes associate with this Assembly Location change: 1) Silicon Die: No change 2) Backend Assembly Bill of Materials: No change 3) Backend Assembly Process Flow: No change 4) Backend Assembly Equipment: Equal or better 5) Marking & Labeling: Yes. Changes pls refer to below details.
Advanced Notification - Alternate Assembly Location for IXYS Power Thyristor & Diode Discrete Product Family Littelfuse would like to notify you that we plan to qualify alternate assembly location for IXYS Power Thyristor & Diode Discrete products with BCP (Business Continuous Plan) consideration. Detail affected product list please refer to attached excel file. And below is our planned Qual and official PCN schedule for your reference.
Samsung SDI EMC EOL and Alternative EMC Replacement for IXYS Germany Discrete Packages.Littelfuse would like to notify you that we will replace Epoxy Molding Compound (EMC) material for various IXYS Germany Discrete packages which currently are using Samsung SDI EMC due to their EOL as communicated in previous advanced notice.
This is an advisory notice of an upcoming change of the Epoxy Molding Compound (EMC) material used in various discrete power and IC packages. As you maybe aware, Samsung SDI has decided to exit the EMC material business and as a result we are well advanced in qualifying new materials from alternative vendors. In most instances we are using materials that we have already qualified for similar applications and as such we expecting this to be a relatively low risk exercise. As this affects several different technology / package combinations and will result in a number of individual PCNs, we are providing this advanced overview such that we can work with you as far as possible to minimise the impact and disruption to your business of this upcoming change. Appendix to this notice you will find a detailed list of part numbers affected (an electronic copy is available on request). Individual PCNs will follow in the usual manner and we will do our utmost to release these in logical, concise groups. In the first instance, we would kindly ask you to review the information and address any questions and any specific individual needs to your usual Sales Contact.
Advanced notice of Molding Compound change for various Discrete Power & IC devices This is an advisory notice of an upcoming change of the Epoxy Molding Compound (EMC) material used in various discrete power and IC packages. As you maybe aware, Samsung SDI has decided to exit the EMC material business and as a result we are well advanced in qualifying new materials from alternative vendors. In most instances we are using materials that we have already qualified for similar applications and as such we expecting this to be a relatively low risk exercise. As this affects several different technology / package combinations and will result in a number of individual PCNs, we are providing this advanced overview such that we can work with you as far as possible to minimise the impact and disruption to your business of this upcoming change. Appendix to this notice you will find a detailed list of part numbers affected (an electronic copy is available on request). Individual PCNs will follow in the usual manner and we will do our utmost to release these in logical, concise groups. In the first instance, we would kindly ask you to review the information and address any questions and any specific individual needs to your usual Sales contact.
This is an advisory notice of an upcoming change of the Epoxy Molding Compound (EMC) material used in various discrete power and IC packages. As you maybe aware, Samsung SDI has decided to exit the EMC material business and as a result we are well advanced in qualifying new materials from alternative vendors. In most instances we are using materials that we have already qualified for similar applications and as such we expecting this to be a relatively low risk exercise.
Part Status:
IXYS FUO50-16N - Technical Attributes
| Average Rectified Current-Max: | 50A |
| Reverse Voltage-Max [Vrrm]: | 1600V |
| Peak Current-Max: | 200A |
| Reverse Current-Max: | 1µA |
| Forward Voltage: | 1.3V |
| Package Style: | ISOPLUS-I4-PAK |
| Mounting Method: | Through Hole |
Features & Applications
The FUO50-16N is a Three Phase Rectifier Bridge with maximum reverse voltage of 1600 V and average rectified curretn of 50 A, available in ISOPLUS-14 package.
Features:
- Rectifier diodes for line frequency
- ISOPLUS i4-PACTM package
- Isolated back surface
- UL registered E 72873
- Low coupling capacity between pins and heatsink
- Enlarged creepage towards heatsink
- Application friendly pinout
- High reliability
- Industry standard outline
Applications:
- Three phase main rectifiers
Available Packaging
Package Qty:
25 per Tube
Package Style:
ISOPLUS-I4-PAK
Mounting Method:
Through Hole