Manufacturer Part #
DSEP2X31-03A
DSEP2X31-03A Series 300 V 30 A High Performance Fast Recovery Diode - SOT-227B
| | |||||||||||
| | |||||||||||
| Mfr. Name: | IXYS | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:10 per Tube Mounting Method:Chassis Mount | ||||||||||
| Date Code: | 2426 | ||||||||||
IXYS DSEP2X31-03A - Product Specification
Shipping Information:
ECCN:
PCN Information:
Littelfuse would like to notify you that we will transfer our backend assembly process of Thyristor & Diode products SOT-227 Package to our new inhouse assembly factory in Lipa, Philippines. This brand-new assembly factory is to fulfill our strategy to invest in state-of-the-art power semiconductor assembly capabilities to dramatically improve our service levels to customers. Our target is to build this factory as a world class facility with automated, error proof processes to meet the highest quality standards. Contact our local Sales team in case you would like to understand more about this new factory. Below is the detail changes associate with this Assembly Location change: 1) Silicon Die: No change 2) Backend Assembly Bill of Materials: No change 3) Backend Assembly Process Flow: Some part numbers change from Pad type to Padless type. Refer to PCN report. 4) Backend Assembly Equipment: Equal or better 5) Marking & Labeling: Yes.
SUBJECT: Assembled Device Marking Format Changes and Outer Box/Bag Label Format Changes - Change to the assembled device marking format The change affects the date code and tracking number identification. This change does not affect the form, fit or function of the product. See attached for more details - Change to the box label format: The paper sticker label found on the outer box or bag will see a format change that incorporates the Littelfuse logo along with the IXYS logo. The printed information remains the same (PN, Qty, Lot #, date code, country of origin). The change allows for a improved readability. This change does not affect the form, fit or function of the product. REMARKS: This changes from the original IXYS Corporation marking/labeling format to the new IXYS LLC-USA format is being done to conform to the SAP product management system requirements of our parent company Littelfuse Corporation.
We want to share with you a brief update on the Littelfuse power semiconductor manufacturing site in Lampertheim, Germany. The site recently experienced an electrical fire that occurred at the power distribution panel on the subfloor of the fab. All employees were safely evacuated, and the site has resumed some operations. The fire did not spread to the manufacturing floor, but this unforeseeable event will cause an interruption to our production. As a result of this incident, despite our urgent recovery actions, you will encounter approximately a 10 week delay to your current delivery schedule for our thyristors rectifier, and fast diodes, as well as any module that includes these components. We sincerely apologize for the inconvenience. Your Littelfuse Customer Service Representative will make the necessary adjustments to your order and also contact you if there are any further changes to this schedule. Please understand that our entire global team is diligently working to resolve this issue as fast as possible to minimize your disruption.
Product Change Notification for Littelfuse Discrete SOT-227B package - Introduction of Laser Marking in Portugal Assembly Location DESCRIPTION OF THE CHANGE: Starting from December 1st, 2021 the marking of the SOT-227B package will change from inkjet marking to laser marking. A comparison can be seen in the attached Figure 1 and 2 No Fit/Form/Function change with the new LASER marking.
Part Status:
IXYS DSEP2X31-03A - Technical Attributes
| Mounting Method: | Chassis Mount |
Available Packaging
Package Qty:
10 per Tube
Mounting Method:
Chassis Mount