Manufacturer Part #
ESD Suppressors / TVS Diodes TVS
PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change:Implement top marking changes for various Microsemi HRDS products available in 8L, 14L, 16L SOIC and QFN-143 packages at MMT assembly site.Impacts to Data Sheet: Where applicableChange Impact:NoneReason for Change:To improve manufacturability and traceability by standardizing marking format for selected Microsemi products as part of the integration of Microchip and Microsemi.Change Implementation Status:In Progress Estimated First Ship Date: July 01, 2021 (date code: 2127)
Description of Change:Implement Microchip Aging Policy, Combination rules, Packing Materials and Labels, Shipping Materials, Labels, Documentation changes and catalog part numbers (CPN) convention changes for selected Microsemi RFTS Santa Clara (RF & Microwave Transistor Solutions)products and implement Inner Label changes for selected Microsemi HRDS CBU (High Reliability Discrete Solutions) products.Reason for Change:To improve productivity by standardizing the packing method as part of the integration of Microsemi and Microchip.
Description of Change: Implement Microchip Part Aging Policy, Tape and Reel Combination rules, Label and Packing Changes for selected Microsemi High Reliability Discrete Solutions (HRDS) products including products with cage codes/manufacturer codes 43611/CDWR and SD633/CIRL.Pre Change:Using Microsemi�s packing processPost Change:Using Microchip�s packing process.Reason for Change:To improve productivity by standardizing the packing method as part of the integration of Microsemi and Microchip.Estimated Implementation Date:February 15, 2021 (date code: 2108)
Initial notification for qualification of an additional wafer fabrication site (Microchip Fab 5) for selected discrete products of Microsemi, a Microchip Company.Description of Change:Qualification of an additional wafer fabrication site (Microchip Fab 5) for selected discrete products of Microsemi, a Microchip Company.Pre-Change:Fabricated utilizing 3 or 4 wafer diameters at Microsemi Lawrence, MA site.Post Change:Fabricated utilizing 3 or 4 wafer diameters at Microsemi Lawrence, MA or 6 wafer diameters Microchip Technology Colorado (Fab 5) site.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying an additional wafer fabrication source at Microchip Technology Colorado Fab 5.Estimated First Qualification Date: March 2021