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Manufacturer Part #
IXTQ69N30P
N-Channel 300 V 69 A 49 mΩ Through Hole PolarHT Power Mosfet - TO-3P
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| Mfr. Name: | IXYS | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:30 per Tube Package Style:TO-3P Mounting Method:Through Hole | ||||||||||
| Date Code: | |||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
This is an advisory notice of an upcoming change of the Epoxy Molding Compound (EMC) material used in various discrete power and IC packages. As you maybe aware, Samsung SDI has decided to exit the EMC material business and as a result we are well advanced in qualifying new materials from alternative vendors. In most instances we are using materials that we have already qualified for similar applications and as such we expecting this to be a relatively low risk exercise. As this affects several different technology / package combinations and will result in a number of individual PCNs, we are providing this advanced overview such that we can work with you as far as possible to minimise the impact and disruption to your business of this upcoming change. Appendix to this notice you will find a detailed list of part numbers affected (an electronic copy is available on request). Individual PCNs will follow in the usual manner and we will do our utmost to release these in logical, concise groups. In the first instance, we would kindly ask you to review the information and address any questions and any specific individual needs to your usual Sales Contact.
Advanced notice of Molding Compound change for various Discrete Power & IC devices This is an advisory notice of an upcoming change of the Epoxy Molding Compound (EMC) material used in various discrete power and IC packages. As you maybe aware, Samsung SDI has decided to exit the EMC material business and as a result we are well advanced in qualifying new materials from alternative vendors. In most instances we are using materials that we have already qualified for similar applications and as such we expecting this to be a relatively low risk exercise. As this affects several different technology / package combinations and will result in a number of individual PCNs, we are providing this advanced overview such that we can work with you as far as possible to minimise the impact and disruption to your business of this upcoming change. Appendix to this notice you will find a detailed list of part numbers affected (an electronic copy is available on request). Individual PCNs will follow in the usual manner and we will do our utmost to release these in logical, concise groups. In the first instance, we would kindly ask you to review the information and address any questions and any specific individual needs to your usual Sales contact.
This is an advisory notice of an upcoming change of the Epoxy Molding Compound (EMC) material used in various discrete power and IC packages. As you maybe aware, Samsung SDI has decided to exit the EMC material business and as a result we are well advanced in qualifying new materials from alternative vendors. In most instances we are using materials that we have already qualified for similar applications and as such we expecting this to be a relatively low risk exercise.
Part Status:
Technical Attributes
| Fet Type: | N-Ch |
| Drain-to-Source Voltage [Vdss]: | 300V |
| Drain-Source On Resistance-Max: | 49mΩ |
| Rated Power Dissipation: | 500|W |
| Qg Gate Charge: | 156nC |
| Package Style: | TO-3P |
| Mounting Method: | Through Hole |
Available Packaging
Package Qty:
30 per Tube
Package Style:
TO-3P
Mounting Method:
Through Hole
